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Freescale Introduces Breakthrough Ultra-Wideband RF Power GaN Transistors in Advanced Plastic PackagesFreescale Semiconductor (News - Alert) [NYSE: FSL], the global leader in radio frequency (RF) power transistors, today introduced two ultra-wideband RF power gallium nitride (GaN) transistors in new advanced plastic packages. With these new packages and products, Freescale has made major advancements in its mission to unleash the true potential of GaN performance, and to provide the best-performing GaN devices in the industry. "The industry-leading bandwidth of these two products will enable our customers to replace two or even three separate RF PA's with a single RF lineup, vastly reducing system cost," said Paul Hart, senior vice president and general manager of Freescale's RF business. "In addition, the devices' ultra-low thermal resistance will allow customers to reduce the cost of their cooling systems, or run at full CW-rated power to much higher case temperatures." The new OM-270 package, offered in two-lead and eight-lead configurations, extends Freescale's proprietary OMNI™ RF plastic packaging technology to the smallest outline yet, and adds compatibility with GaN. "We have innovated the capability to metalurgically bond our GaN-on-SiC chips to copper flanges, and over-mold them to enable unprecedented thermal performance," said Mali Mahalingam, Freescale Fellow and head of RF package development. "In addition, this new package platform supports complex internal matching schemes that enable superior broadband performance." Freescale's first two plastic RF power GaN transistors to take advantage of this advanced packaging technology and offe new levels of performance are:
Freescale is displaying and demonstrating these transistors at the 2015 International Microwave Symposium (IMS) in Booth #3031. Planned for volume production in Q3 2015, both new products are included in Freescale's Product Longevity Program, as are all products in the RF Military portfolio. For program Terms and Conditions, and to obtain a list of available products please see: www.Freescale.com/productlongevity. About Freescale Semiconductor Freescale Semiconductor (NYSE:FSL) enables secure, embedded processing solutions for the Internet of Tomorrow. Freescale's solutions drive a more innovative and connected world, simplifying our lives and making us safer. While serving the world's largest companies, Freescale is also committed to supporting science, technology, engineering and math (STEM) education, enabling the next generation of innovators. www.freescale.com. About the Freescale Technology Forum For ten years, the Freescale Technology Forum (FTF) has driven innovation and collaboration by featuring one of the most comprehensive embedded ecosystems in the industry. FTF provides the training and expertise customers need to create and enable the secure, embedded solutions needed for the Internet of Things-today and tomorrow. FTF features four days of in-depth training, hands-on workshops, demonstrations from Freescale and ecosystem partners and exceptional opportunities to collaborate with industry peers and visionaries. The forum has been enthusiastically received by the global developer community, drawing more than 67,500 attendees worldwide since its inception in 2005. FTF takes place June 22-25, 2015, in Austin, Texas. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. Airfast is a trademark of Freescale Semiconductor, Inc. (News - Alert) All other product or service names are the property of their respective owners. © 2015 Freescale Semiconductor, Inc.
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