Thin Layer Deposition Equipment - Global Strategic Business Report 2015: Increasing Use of Semiconductors in LCD TVs Drive Demand

DUBLIN, Mar. 24, 2015 /PRNewswire/ --Research and Markets

(http://www.researchandmarkets.com/research/dtwjjb/thin_layer) has announced the addition of the "Thin Layer Deposition Equipment - Global Strategic Business Report" report to their offering.

Annual estimates and forecasts are provided for the period 2014 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research.

This report analyzes the worldwide markets for Thin Layer Deposition Equipment in US$ Million by the following Deposition Technologies: Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) [Plasma CVD, Low Pressure CVD, & Other CVD], Atomic Layer Deposition (ALD), and Epitaxy. The report provides separate comprehensive analytics for the US, Japan, Europe, China, South Korea, Taiwan, and Rest of World.

The report profiles 114 companies including many key and niche players such as:

• AIXTRON SE (Germany)
• Applied Materials, Inc. (USA)
• ASM International N.V. (The Netherlands)
• Canon ANELVA Corporation (Japan)
• CHA Industries, Inc. (USA)
• CVD Equipment Corporation (USA)
• Denton Vacuum, LLC (USA)
• Edwards Limited (UK)
• Ionbond AG (Switzerland)
• Jusung Engineering Co., Ltd. (Korea)
• KDF Electronic & Vacuum Services, Inc. (USA)
• Kokusai Semiconductor Equipment Corporation (USA)
• Lam Research Corporation (USA)
• RIBER SA (France)
• Seki Diamond Systems (USA)
• Silicon Genesis Corporation (USA)
• SPTS Technologies (USA)
• Ti-Coating, Inc. (USA)
• Tokyo Electron Limited (Japan)
• Taiyo Nippon Sanso Corporation (Japan)
• ULVAC Technologies, Inc. (USA)
• Vapor Technologies, Inc. (USA)
• Veeco Instruments, Inc. (USA)

Key Topics Covered:

1. INDUSTRY OVERVIEW

• Thin Layer Deposition Equipment: A Prelude
• Outlook
• Chemical Vapor Deposition Equipment - The Dominant Market Segment
• Design Rule Upgrades Bring Cheer to CVD Equipment Makers in Semiconductor Segment
• Atomic Layer Deposition Equipment: The Fastest Growing Segment
• Lean PVDs Set to Gather Steam
• Rising Demand for Microelectronics Creates Huge Opportunities
• High Thrust on Semiconductor R&D Generates Parallel Demand for Advanced Deposition Systems
• Innovative Deposition Systems for 3D Architectures
• Semiconductor Industry: Largest Application Market of Thin Layer Deposition Equipment
• Fab: The Semiconductor Fabrication Facility
• Sustained Growth in Semiconductor Manufacturing Bodes Well for the Market
• Booming Consumer Electronics Market Spurs Growth in Semiconductor Fabrication Equipment
• Robust Growth in Mobile Phone Adoption Augurs Well for the Market
• Increasing Use of Semiconductors in LCD TVs Drive Demand
• Computing Devices: A Key Growth Driver
• Automotive Electronics Adds to the Demand
• Impact of the 2007-2009 Recession: A Review in Retrospect
• Steady Demand for Copper Deposition Equipment in Memory Devices Market
• Competitive Landscape
• Established Majors Rule Thin Film Deposition Market
• Equipment Vendors Aim to Adopt One Stop Shop' Concept

• Thin Layer Deposition: An Introduction
• Role of Evaporation in Thin Layer Deposition
• Deposition Techniques by Technology Type
• Physical Vapor Deposition (PVD): A Technical Run-through
• Advantages
• Disadvantages
• Sputtering: An Enabling PVD Process
• Sputtering Materials
• Types of Sputtering
• DC Diode Sputtering
• Radio-Frequency RF Diode Sputtering
• DC and RF Magnetron Sputtering
• Ion Beam Sputtering
• Chemical Vapor Deposition (CVD): A Technical Overview
• Advantages
• Types
• Plasma Enhanced Chemical Vapor Deposition (PECVD)
• Low Pressure Chemical Vapor Deposition (LPCVD)
• Other CVD Techniques
• Atmospheric Pressure Chemical Vapor Deposition (APCVD)
• Metal Organic Chemical Vapor Deposition (MOCVD)
• Rapid Thermal Chemical Vapor Deposition (RTCVD)
• High-Density Plasma Chemical Vapor Deposition (HDPCVD)
• Atomic Layer Deposition (ALD)
• Advantages of ALD
• End-Use Application Areas
• Capacitor Layers
• Gate Dielectrics
• Interconnects
• Non-Semiconductor Applications
• Epitaxy
• Other Deposition Techniques
• Electrochemical Deposition (ECD)
• Molecular Beam Epitaxy (MBE)
• Ion Beam Deposition (IBD)
• Ion Implantation
• Types of Ion Implantation Tools
• Pulsed Plasma Doping: A Generation-X Ion Implantation Technology
• A Quick Primer on Etching
• Chemical Etch
• Plasma Etch
• Thin Layer Deposition Equipment in Semiconductor Manufacturing
• Applications
• Thin Layer Deposition Equipment in Other End Use Applications: A Complementary Review
• A Peek into TFD Materials & Technologies for Various Industry Segments
• Microelectronics Industry
• Primary Segments (Other than Semiconductors)
• Optoelectronic Components
• Applications of TFD Equipment
• CVD Equipment & Thin Film Materials for the FPD Industry
• Key Technologies
• Data Storage
• Medical Technology
• Techniques Used
• Cutting Tools
• Industrial & Energy Market
• Key TFD Technologies Used
• Specialty Packaging
• Typical Structure of a Flexible Package
• Package Productivity Rises with Thin Film Coating
• Optics Industry

3. PRODUCT INNOVATIONS/INTRODUCTIONS

• Applied Materials Launches Applied Producer® XP Precision CVD System
• SPTS Technologies Launches Sigma® fxP PVD System
• AIXTRON Unveils AIX G5+ Technology Package for AIX G5 Planetary Reactor Platform
• SINGULUS Launches ROTARIS Sputter Deposition System
• ASM International Launches Advanced Deposition Systems

4. RECENT INDUSTRY ACTIVITY

• Orbotech Takes Over SPTS Technologies
• SPTS Technologies Bags Order from HuaTian Technologies
• CVD Equipment Sells New York Facility
• Philips Innovation Services Selects NEXUS® PVD System of Veeco Instruments
• Veeco Instruments Receives MOCVD Order from Sanan Optoelectronics
• CVD Equipment Inks Joint Intellectual Property Development Agreement with Grafoid
• IBM Enters into Collaboration with TEL NEXX
• Novellus Systems Merges with Lam Research
• Tokyo Electron to Take Over NEXX Systems
• Seki Technotron to Merge with Cornes Technologies
• Denton Vacuum Establishes New CADC in New Jersey
• AIXTRON Bags Order for CCS System from UMI Georgia Tech-CNRS
• AIXTRON Secures Order from JENOPTIK Diode Lab
• Tokyo Electron to Take Over Oerlikon Solar
• AIXTRON Secures Order for BM Pro PECVD System from IMR
• AIXTRON Obtains Order for CRIUS II-L Reactor from Sinoepi
• AIXTRON Receives New Order for CCS MOCVD System from NCU

5. FOCUS ON SELECT PLAYERS

6. GLOBAL MARKET PERSPECTIVE 

Total Companies Profiled: 114 (including Divisions/Subsidiaries - 123)

• The United States (59)
• Canada (2)
• Japan (16)
• Europe (32)
• - France (5)
• - Germany (6)
• - The United Kingdom (7)
• - Italy (1)
• - Rest of Europe (13)
• Asia-Pacific (Excluding Japan) (12)
• Middle East (2)

For more information visit http://www.researchandmarkets.com/research/dtwjjb/thin_layer

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/thin-layer-deposition-equipment---global-strategic-business-report-2015-increasing-use-of-semiconductors-in-lcd-tvs-drive-demand-300055027.html

SOURCE Research and Markets

[ Back To TMCnet.com's Homepage ]