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Freescale FXTH87 - MEMS TPMS - Reverse Costing AnalysisDUBLIN, Feb. 23, 2015 /PRNewswire/ --Research and Markets (http://www.researchandmarkets.com/research/34jbg5/freescale_fxth87) has announced the addition of the "Freescale FXTH87 - MEMS TPMS - Reverse Costing Analysis" report to their offering. Pressure sensor market growth is mainly driven by TPMS due to legislation and quick adoption around the world. Key Topics Covered: 1. Overview / Introduction - Executive Summary - Reverse Costing Methodology 2. Company Profile - Freescale Semiconductor - FXTH87 Characteristics 3. Physical Analysis - Synthesis of the Physical Analysis - Physical Analysis Methodology Package - Package Views, Dimensions & Pin Out - Package Opening & Wire Bonding Process - Package Cross-Section ASIC 28 - View, Dimensions & Marking - Delayering - Main Blocks Identification - Process Identification - Cross-Section - Process Characteristics MEMS Pressure Sensor 41 - View, Dimensions & Marking - Sensing Area Details - Cross-Section - Process Characteristics MEMS Accelerometer - View, Dimensions & Marking - Bond Pad Opening & Bond Pad - Cap Removed & Cap Details - Sensing Area Details - Cross-Section - Process Characteristics 4. Physical Comparison with Infineon SP37 5. Manufacturing Process Flow - Global Overview - ASIC Front-End Process - ASIC Wafer Fabrication Unit - MEMS Pressure Sensor Process Flow - MEMS Accelerometer Process Flow - MEMS Wafer Fabrication Unit - Packaging Process Flow & Assembly Unit 6. Cost Analysis - Synthesis of the cost analysis - Main steps of economic analysis - Yields Hypotheses ASIC - ASIC Front-End Cost - ASIC Probe Test & Dicing Cost - ASIC Wafer & Die Cost MEMS Pressure Sensor - MEMS Pressure Sensor Front-End Cost - MEMS Pressure Sensor Cost per process steps - MEMS Pressure Sensor Probe Test & Dicing Cost - MEMS Pressure Sensor Wafer & Die Cost MEMS Accelerometer - MEMS Accelerometer Front-End Cost - MEMS Accelerometer Cost per process steps - MEMS Accelerometer Probe Test & Dicing Cost - MEMS Accelerometer Wafer & Die Cost - Back-End : Final Test & Calibration Cost - FXTH87 Component Cost 7. Estimated Price Analysis - Manufacturer Financial Ratios - Estimated Selling Price For more information visit http://www.researchandmarkets.com/research/34jbg5/freescale_fxth87 Media Contact: Laura Wood , +353-1-481-1716, [email protected] To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/freescale-fxth87---mems-tpms---reverse-costing-analysis-300039564.html SOURCE Research and Markets |