[February 20, 2015]

Research and Markets: InvenSense MP67B - Reverse Costing Analysis

Research and Markets (http://www.researchandmarkets.com/research/6sj6lq/_invensense_mp67b) has announced the addition of the " InvenSense MP67B - Reverse Costing Analysis" report to their offering.

With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics (News - Alert) as the supplier of the gyroscope for the iPhone 6 and 6 Plus.

The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple (News - Alert). Compared to InvenSense's standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses the same process as InvenSense's second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changd: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

Key Topics Covered:

1. Overview / Introduction

- Executive Summary

- Reverse Costing Methodology

2. Company Profile

- InvenSense Profile

- iPhone (News - Alert) 6 Teardown

3. Physical Analysis

- Synthesis of the Physical Analysis

- Physical Analysis Methodology

Package

- Package View & Dimensions

- Package Opening

- Package Cross-Section

Die

- View, Dimensions & Marking

- MEMS Removed

- MEMS Sensing Area: Gyroscope

- MEMS Sensing Area: X/Y-Axis (News - Alert) Accelerometer

- MEMS Sensing Area: Z-Axis Accelerometer

- MEMS Cap- ASIC Delayering & Process

- Die Cross-Section: ASIC

- Die Cross-Section: MEMS (Pads Opening)

- Die Cross-Section: MEMS (Sealing)

- Die Cross-Section: Sensor (Electrical Contacts)

- Die Cross-Section: Sensor (Standoffs)

- Die Cross-Section: Sensor (Al-GE Bonding)

- Die Cross-Section: Sensor (Mobile Elements)

- Die Cross-Section: Cap

- Comparison with MPU-6

- Comparison with previous generation

5. Manufacturing Process Flow

- Global Overview

- ASIC Front-End Process

- MEMS Process Flow

- Wafer Fabrication Unit

- Packaging Process Flow

- Package Assembly Unit

6. Cost Analysis

- Synthesis of the cost analysis- Main steps of economic analysis

- Yields Hypotheses

- ASIC Front-End Cost

- MEMS Front-End Cost

- ASIC/MEMS Assembly Cost

- MEMS Front-End Cost per process steps

- Total Front-end Cost

- Back-End : Probe Test & Dicing

- Wafer & Die Cost

- Back-End : Packaging Cost

- Back-End : Packaging Cost per Process Steps

- Back-End : Final Test & Calibration Cost

- Component Cost

7. Estimated Price Analysis

- InvenSense Financial Ratios

- Component Estimated Price

For more information visit http://www.researchandmarkets.com/research/6sj6lq/_invensense_mp67b

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