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Reverse Costing Analysis of Apple's iPhone 6 & 6 Plus Front Facing Camera Module
[February 19, 2015]

Reverse Costing Analysis of Apple's iPhone 6 & 6 Plus Front Facing Camera Module


DUBLIN, Feb .19, 2015 /PRNewswire/ --Research and Markets

(http://www.researchandmarkets.com/research/f3lqwf/apple_iphone_6) has announced the addition of the "Apple iPhone 6 & 6 Plus Front Facing Camera Module - Reverse Costing Analysis" report to their offering.

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For the iPhone 6 FaceTime camera module, Apple continues to integrate a 1.2Mpixel resolution CMOS Image Sensor. 81% of light sensitivity has been increased by using the camera aperture f/2.2, rising the pixel size from 1.75µm to 2.2µm and using an innovative microlenses array.

The unique technology from Sony (Exmor-RS) consists in a stacking of a pixel array circuit which uses a Back-Side Illuminated (BSI) technology and a logic ISP circuit processed with a 65nm technology node. This allows to raise the pixel array size by 15% and to considerably improve the light sensitivity by integrating an innovative grid and lenses design.

The camera module, with dimensions of 6.2 x 6.0 x 3.8mm, is equipped with a 4-elements lens modue integrated in a very low cost package. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.




Key Topics Covered:

1. Overview / Introduction
- Executive Summary & Reverse Costing Methodology


2. Camera Module Supply Chain & Companies Profile
- iPhone 6 Camera Module Supply Chain
- Companies Profile (Sony, LG Innotek)

3. iPhone 6 Teardown

4. Physical Analysis
- Synthesis of the Physical Analysis
- Physical Analysis Methodology
Camera Module
- Camera Module View & Dimensions
- Camera Module X-Ray
- Camera Module Disassembly
Camera Module Cross-Section
- Overview- Housing
- Ceramic Substrate & IR Filter
- Lenses & FPC
CMOS Image Sensor 43
- View & Dimensions
- Pads, TSV Connections & Tungsten Grid
- CIS Pixels
- Logic Circuit (Main blocks, Transistors, SRAM)
CMOS Image Sensor Cross-Section
- Overview- Pixel Array Circuit
- Logic Circuit
- Pad Trenches & TSVs
Comparison with iPhone 6 Rear Camera CIS

5. CIS Manufacturing Process Flow
- Global Overview
- Logic Circuit Front-End Process
- Pixel Array Circuit Front-End Process
- BSI + TSV + Microlenses Process
- CIS Wafer Fabrication Unit

6. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Hypotheses
CMOS Image Sensor Cost
- Logic Circuit Front-End Cost
- Pixel Array Front-end Cost
- BSI & TSV Front-End Cost
- Color Filters & Microlenses Front-End Cost
- Total Front-End Cost
- Back-End: Tests & Dicing
- CIS Wafer and Die Cost
Camera Module Assembly Cost
- Lens Module Cost
- Final Assembly Cost
Camera Module Cost

Companies Mentioned

- Apple
- LG Innotek
- Sony

For more information visit http://www.researchandmarkets.com/research/f3lqwf/apple_iphone_6

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/reverse-costing-analysis-of-apples-iphone-6--6-plus-front-facing-camera-module-300038405.html

SOURCE Research and Markets


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