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STMicroelectronics Assigned Patent for Method for Manufacturing Hybrid SOI/bulk Semiconductor Wafer(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Nov. 11 -- STMicroelectronics, Coppell, Texas, STMicroelectronics, Montrouge, France, STMicroelectronics (Crolles 2), Crolles, France, and Commissariat a l'Energie Atomique et aux Energies Alternatives, Paris, have been assigned a patent (8,877,600) developed by six co-inventors for a "method for manufacturing a hybrid SOI/bulk semiconductor wafer." The co-inventors are Claire Fenouillet-Beranger, Grenoble, France, Stephane Denorme, Crolles, France, Nicolas Loubet, Guilderland, New York, Qing Liu, Guilderland, New York, Emmanuel Richard, le Champ-Pres-Froges, France, and Pierre Perreau, Varces, France. The patent application was filed on Dec. 12, 2013 (14/104,903). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,877,600.PN.&OS=PN/8,877,600&RS=PN/8,877,600 Written by Sudarshan Harpal; edited by Jaya Anand. SH1111JA1111-1077905 (c) 2014 Targeted News Service [ Back To TMCnet.com's Homepage ] |