[October 30, 2014]

Molex MediSpec™ MID/LDS Blends Advanced Technologies In Compact 3D Package

Molex Incorporated will feature MediSpec™ Molded Interconnect Device/Laser Direct Structuring (MID/LDS) in Booth 1518 at the Medical Design & Manufacturing (MD&M) Minneapolis Conference, October 29-30. Molex (News - Alert) developed the innovative 3D technology, which combines advanced MID technology with LDS antenna expertise, to deliver integrated fine-pitch 3D circuitry in a single molded package suitable for high density medical devices meeting stringent medical grade guidelines.

"Surpassing the capabilities of existing 2D technologies, MediSpec MID/LDS 3D shielded circuitry allows medical device designers to integrate highly complex electrical and mechanical features into highly compact applications," states Steve Zeilinger, group product manager, Molex.

Addressing functionality, space, weight and cost savings, the proprietary MediSpec MID/LDS 3D technology blends the versatility of the two-shot MID molding process with the speed and precision of LDS. Scalable from small to large volume production quantities, LDS uses a 3D laser to image micro-line electronic circuitry onto a variety of RoHS-compliant molded plastics, which allows for pattern modification with lines and spaces down to 0.10 mm and circuitry pitch down to 0.35 mm.

Molex provides design and manufacturing experience to customize MediSpec MID/LDS selective trace solutions with miniaturized connectors, circuit vias, switch pads, sensors or even antennas. Suitable for SMT applications meeting specific mechanical requirements, integrated chips, capacitors and inductors can be soldered directly to the selective plating on the RoHS-compliant plastic. Insert and overmolding allows for built-in features to reduce weight and increase functionality.

"An excellent value proposition for miniaturization strategies, our MediSpec 3D interconnect package delivers significant space savings over traditional PCB and flex circuit designs," adds Zeilinger. "The power of MID/LDS technology to address miniaturization, convergence and healthcare trends in the medical industry is phenomenal."

MediSpec™ MID/LDS 3D packaging is suitable for blood glucose meters, home healthcare telemetry, catheter interfaces, pulse oximetry sensors, hearing aids, and a range of other medical device applications. In addition to full scope engineering support, Molex provides MID/LDS quality control testing to ensure product reliability and performance criteria are met.

Visit Molex Booth 1518 at MD&M Minneapolis or at www.molex.com/link/3dcustomcircuits.html for more information about MediSpec MID/LDS. Please sign up for the Molex e-nouncement newsletter at www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical, and lighting. Established in 1938, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

Molex is a registered trademark of Molex Incorporated.

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