TMCnet News
TSMC introduces new IoT technology platform(China Post (Taiwan) Via Acquire Media NewsEdge) Semiconductor foundry bellwether TSMC yesterday announced a comprehensive ultralow power consumption technology platform designed to cater to the varied applications of the emerging Internet of Things (IoT) and wearable devices markets. The technology platform is based on the company's existing 0.18micron extremely low leakage (0.18eLL), 90nanometer ultra low leakage (90uLL) nodes, and 16nanometer FinFET technology, as well as 55, 40 and 28nanometer ultralow power fabrication technology that are capable of processing speeds of up to 1.2 GHz. Radio frequency and embedded flash memory capabilities are available in configurations ranging from 0.18micron to 40nanometer, meeting device requirements calling for wireless connectivity at smaller form factors. The company noted that as with its full array of ultralow power consumption processes ranging from 0.18micron to 16nanometer FinFET, the technology platform stands up to the innumerable applications in the fledgling IoT and wearable devices markets. According to the company, the technology factor is capable of delivering lower operating voltages by 20 to 30 percent for devices during both standby and active usage, which translates to marked increases in battery life by two to 10 times, an especially important trait when much smaller batteries and form factors are demanded in IoT and wearable applications. "Bringing such a wide spectrum of offerings to the emerging markets of IoT and wearables demonstrates TSMC's technology leadership and commitment to bringing great value to our customers in the form of ultralow power consumption and ubiquitous connectivity offerings," said company President and CoCEO Mark Liu. Intel's Outreach into Chinabased Rivals 'worrying' Meanwhile, as TSMC gears up for a stellar fourth quarter, a report published by Goldman Sachs stated that prospects for the foundry bellwether as well as MediaTek are poised to be challenged by Intel's plans to acquire a 20percent stake in Chinabased Tsinghua Unigroup, a Chinese stateowned company administered by Tsinghua University that includes Spreadtrum Communications and RDA Microelectronics, two rivaling fabless semiconductor companies. Reports indicate that the move is designed to expand the adoption of Intelbased mobile devices, and jointly develop Intel's X86 architecture and communication solutions for smartphones. According to the institutional investor, Tsinghua Unigroup is poised to produce early results in the X86 architecture in the first half of next year, and the company is poised to commit US$5 billion for Spreadtrum Communication's research and development efforts for the next five years. Tsinghua Unigroup is also expected to halt initial public offering plans for both Spreadtrum and RDA Microelectronics. Most notably, the report suggest that with the marked surge in research funding, efforts by MediaTek may be eclipsed by its Chinabased rivals as they accelerate progress toward releasing 4G mobile device chips. |