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Broadcom Assigned Patent for Semiconductor Package Including Substrate and Interposer(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Sept. 11 -- Broadcom, Irvine, California, has been assigned a patent (8,829,655) developed by Sam Ziqun Zhao, Irvine, California, and Rezaur Rahman Khan, Rancho Santa Margarita, California, for a "semiconductor package including a substrate and an interposer." The patent application was filed on Nov. 13, 2013 (14/079,356). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,829,655.PN.&OS=PN/8,829,655&RS=PN/8,829,655 Written by Deviprasad Jena; edited by Jaya Anand. DJ0911JA0911-1058845 (c) 2014 Targeted News Service |