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United States : Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs [TendersInfo (India)](TendersInfo (India) Via Acquire Media NewsEdge) Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC s patented, fine-pitch copper bump-based packaging technology to Altera s 20 nm Arria®10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera s 20 nm device family. TSMC has provideda very advanced and robust integrated package solution for our Arria 10 devices, the highest-density monolithic 20 nm FPGA die in the industry, said Bill Mazotti, vice president of worldwide operations and engineering at Altera. Leveraging this technology is a great complement to Arria 10 FPGAs and SoCs and helps us address the packaging challenges at the 20 nm node. TSMC s leading-edge flip chip BGA package technology provides Arria 10 devices with better quality and reliability than standard copper bumping solutions through the use of fine-pitch copper bumps. The technology is able to accommodate very high bump counts as required by high-performance FPGA products. It also provides excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK (Extra Low-K) layers, all highly critical features for products employing advanced silicon technologies. TSMC s copper bump-based package technology provides excellent value for small bump pitch ( (c) 2014 Euclid Infotech Pvt. Ltd. Provided by Syndigate.info, an Albawaba.com company |