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Freescale Semiconductor Assigned Patent for Flexible Substrate with Crimping Interconnection(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., April 18 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,698,288) developed by Boon Yew Low, Petaling Jaya, Malaysia, Navas Khan Oratti Kalandar, Petaling Jaya, Malaysia, and Sharon Huey Lin Tay, Shah Alam, Malaysia, for a "flexible substrate with crimping interconnection." The patent application was filed on May 23, 2013 (13/901,563). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,698,288.PN.&OS=PN/8,698,288&RS=PN/8,698,288 Written by Balkishan Dalai; edited by Jaya Anand. BD0418JA0418-1001966 (c) 2014 Targeted News Service |