[February 11, 2014] |
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Interlink Electronics, Inc. Announces a New Addition to the Executive Team and the Establishment of its Subsidiary in the United Kingdom
CAMARILLO, Calif. --(Business Wire)--
Interlink (News - Alert) Electronics, Inc. (OTC: LINK), a global leader in sensor and
human-machine interface technologies, today announced the establishment
of a wholly-owned subsidiary named Interlink Electronics Europe Limited,
which was incorporated in the United Kingdom on January 31, 2014.
Interlink Electronics Europe Limited will serve as our European regional
sales office and the base for our new Vice President of Global Sales and
Business Development. Additionally, Interlink Electronics is proud to
announce that Neil Jarvie will join the Company on May 5, 2014 in the
role of Vice President of Global Sales and Business Development. Neil
Jarvie will report to Dr. Howard Goldberg, the President and COO of
Interlink Electronics.
Neil Jarvie comes to Interlink Electronics with over 20 years of
experience in high-technology sales and strategic account management.
Since 2011, Mr. Jarvie has been the Vice President of Sales at Peratech
Limited, a global R&D innovator and intellectual property licensor of
touch-sensor materials used in human-machine interface applications. At
Peratech, Mr. Jarvie defined and established a "go-to-market" strategy,
process, and systems that resulted in significant increases in R&D
development and licensing revenues. Prior to Peratech, Mr. Jarvie had
spent 12 years at Cypress Semiconductor as the Global Account Manager,
where he drove significant revenue growth multiples in the sale of
capacitive touch controller products to leading mobile device
manufacturers. In 2008, Mr. Jarvie was the recipient of the Cypress
"Salesperson of the Year Award." Mr. Jarvie had also held sales and
account management roles of increasing responsibility at Rohm
Electronics and Murata Electronics, where his accomplishments include
establishing a regional sales office and quadrupling sales in just 24
months. Mr. Jarvie studied electrical and electronic engineering at
Newcastle Polytechnic (Northumbria University) in Newcastle, UK, and he
was sponsored by GEC Plessey Telecommunications.
"Interlink Electronics is excited to have as eil Jarvie join our
executive team as he offers a unique blend of hands-on and seasoned
sales leadership that has resulted in the successful establishment of
sales organizations and new revenue growth, while servicing a global,
high-tech Fortune-500 customer base. Neil's deep understanding of
finding successful commercial solutions and new application domains in
the human-machine interface market aligns well with the future growth
initiatives of Interlink Electronics," stated Howard D. Goldberg, Ph.D.,
President and COO of Interlink Electronics. Dr. Goldberg continued, "Our
new sales office in the UK allows us to fully leverage the inherent
synergies in the strategic geographic triangle of USA, UK, and Asia.
Additionally, the UK has a relevant history in human-machine interface
materials and product innovation that dates back to the development of
trackball devices used for WWII radar control."
About Interlink Electronics, Inc.
Interlink Electronics is a world-leading trusted advisor and technology
partner in the advancing world of touch-sensor and human-machine
interface technologies. Interlink Electronics has led the printed
electronics industry in the commercialization of its patented
Force-Sensing Resistor (FSR®) technology, which has enabled rugged and
reliable human-machine interface ("HMI") solutions. For over 29 years,
Interlink Electronics' solutions have focused on handheld user input,
menu navigation, cursor control, and other intuitive interface
technologies for the world's top electronics manufacturers. Interlink
Electronics has a proven track record of supplying human-machine
interface solutions for mission-critical applications in a wide range of
markets, including, but not limited to, consumer electronics,
automotive, industrial, and medical devices. Interlink Electronics
serves a world-class customer-base from its corporate headquarters in
Camarillo, California (greater Los Angeles area), state-of-the-art
printed-electronics factory in China, global distribution and warehouse
facility in Hong Kong, and offices in the United Kingdom, Japan and
Singapore. For more information, please see http://www.interlinkelectronics.com.
FORWARD-LOOKING STATEMENTS: This release contains "forward-looking
statements" involving a number of risks and uncertainties as defined in
the Private Securities Litigation Reform Act of 1995. The following are
among the factors that could cause actual results to differ materially
from the forward-looking statements: historical losses and negative cash
flow, the success of business divestitures and acquisitions, the
ownership of the majority of our stock by a small group of investors,
our success in predicting new markets and the acceptance of our new
products, efficient management of our infrastructure, the pace of
technological developments and industry standards evolution and their
effect on our target product and market choices, the effect of
outsourcing technology development, changes in the ordering patterns of
our customers, a decrease in the quality and/or reliability of our
products, protection of our proprietary intellectual property,
competition by alternative sophisticated as well as generic products,
pending litigation against Interlink Electronics, historical weaknesses
in internal controls over financial reporting, continued availability of
raw materials for our products at competitive prices, disruptions in our
manufacturing facilities, risks of international sales and operations
including fluctuations in exchange rates, compliance with regulatory
requirements applicable to our manufacturing operations, and customer
concentrations. The forward-looking statements contained in this release
should be considered in light of these risk factors.

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