[June 10, 2013] Atmel Assigned Patent Tweet (Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., June 10 -- Atmel, San Jose, Calif., has been assigned a patent (8,455,304) developed by Ken Lam, Colorado Springs, Colo., for a "routable array metal integrated circuit package fabricated using partial etching process." The abstract of the patent published by the U.S. Patent and Trademark Office states: "An integrated circuit assembly is fabricated on a metal substrate strip in an array format that has raised circuitry pattern formed by photolithographic and metal etching processes. The circuitry pattern is formed on one side of the metal substrate only. The raised circuitry's etch depth extends partially through the metal substrate. Die attachment can be performed using a non-conductive material applied directly onto and around the raised circuitry features directly under the die. After wirebond and molding processes, the molded metal substrate strip assembly is processed through a metal etching process to remove the metal substrate portion that is exposed beyond the mold cap. A solder mask coating can be applied to protect the metal circuitry and to define the package pad opening to form Land-Grid-Array (LGA) packages. Solder balls can also be attached to form Ball-Grid-Array (BGA) packages." The patent application was filed on July 30, 2010 (12/848,065). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,455,304.PN.&OS=PN/8,455,304&RS=PN/8,455,304 Written by Kusum Sangma; edited by Anand Kumar. KS0610AK0610-887213 (c) 2013 Targeted News Service [ Back To TMCnet.com's Homepage ]