[May 24, 2013] Invensas to Showcase High Bandwidth Packaging Solution for Mobile Devices at ECTC Tweet May 24, 2013 (Close-Up Media via COMTEX) -- Invensas Corp., a wholly owned subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas on May 28 - 31. According to a release, the solution was brought to high volume market readiness in collaboration with Kulicke & Soffa Industries, Inc. (K&S), Universal Instruments Corp., and Celestica Inc., all leaders in their respective industries. "The BVA platform provides smartphone and tablet makers with a roadmap to much higher bandwidth and lower power consumption, enabling high definition mobile gaming, multi-channel video, and a host of new data-rich applications on next generation mobile devices," said Simon McElrea, president of Invensas Corp. "With greater than 1,000 interconnects, twice that of the current competition, in a tiny 14x14mm package-on-package form factor, BVA is by far the mobile industry's highest bandwidth solution." The technology, which relies on conventional manufacturing infrastructure, enables the interconnection of System on Chip (SOC), Central Processing Unit (CPU), and Graphics Processing Unit (GPU) chips with their associated memory chips. It accommodates Double Data Rate 3/4 (DDR3/4 ) DRAM, Low Power Double Data Rate (LPDDR) and "Wide-IO" DRAM, as well as Flash and Multi Chip Package (MCP) memory. 512 bit memory bus width is supported which, at 800MHz operation, delivers an unprecedented 100GB/s bandwidth. Invensas Corp., a wholly owned subsidiary of Tessera Technologies, Inc., is a provider of semiconductor interconnect solutions and intellectual property. More information: www.invensas.com ((Comments on this story may be sent to [email protected])) [ Back To TMCnet.com's Homepage ]