[May 17, 2013] Amkor Technology Assigned Patent Tweet (Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., May 17 -- Amkor Technology, Chandler, Ariz., has been assigned a patent (8,441,123) developed by four co-inventors for a "semiconductor device with metal dam and fabricating method." The co-inventors are Dong Hee Lee, Incheon, South Korea, Min Yoo, Seoul, South Korea, Dae Byoung Kang, Seoul, South Korea, and Bae Yong Kim, Jeollanam-do, South Korea. The abstract of the patent published by the U.S. Patent and Trademark Office states: "A semiconductor device has a first semiconductor die having at least one metal pillar formed along an inner perimeter and at least one bond pad formed along an outer perimeter. A second semiconductor die has at least one metal pillar. A conductive bump connects the at least one metal pillar of the first semiconductor die to the at least one metal pillar of the second semiconductor die. At least one metal dam is formed on the first semiconductor die between the at least one metal pillar of the first semiconductor die and the at least one bond pad." The patent application was filed on Aug. 13, 2009 (12/540,593). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,441,123&OS=8,441,123&RS=8,441,123 Written by Arpi Sharma; edited by Anand Kumar. AS0517AK0517-878384 (c) 2013 Targeted News Service [ Back To TMCnet.com's Homepage ]