[May 13, 2013] Molex Assigned Patent Tweet (Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., May 13 -- Molex, Lisle, Ill., has been assigned a patent (8,435,077) developed by Yong Teck Yang, Singapore, for a "card edge connector and connector assembly thereof." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A card edge connector comprises an insulation housing and a plurality of terminals. The insulation housing includes a receiving slot for receiving a card module, a plurality of partitions arrayed on opposite sides of the receiving slot and defining a plurality of cavities, each partition including a bottom surface configured to be disposed on a printed circuit board. Each terminal comprises a body portion having a fixing portion configured to secure the terminal in the respective cavity and an inversely bent section, a solder tail extending from the fixing portion, and a contact portion extending from the inversely bent section and having a distal end at least partially protruding beyond the bottom surface." The patent application was filed on March 25, 2011 (13/072,302). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,435,077&OS=8,435,077&RS=8,435,077 Written by Satyaban Rath; edited by Hemanta Panigrahi. SR0513HP0513-876326 (c) 2013 Targeted News Service [ Back To TMCnet.com's Homepage ]