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Flextronics AP Assigned Patent(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., May 6 -- Flextronics AP, Broomfield, Colo., has been assigned a patent (8,430,579) developed by Samuel Waising Tam, Daly City, Calif., Tai Wai (David) Pun, Hong Kong, and Tak Shing (Dick) Pang, Hong Kong, for a "camera module with molded tape flip chip imager mount and method of manufacture." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted. A disclosed method for manufacturing camera modules includes providing a flexible circuit tape having a plurality of discrete circuit regions, providing a plurality of image capture devices, flip-chip mounting each image capture device on an associate one of the discrete circuit regions, providing a plurality of housings, and mounting each housing on an associate one of the discrete circuit regions." The patent application was filed on Jan. 11, 2011 (12/930,606). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,430,579&OS=8,430,579&RS=8,430,579 Written by Satyaban Rath; edited by Hemanta Panigrahi. SR0506HP0506-874153 (c) 2013 Targeted News Service |