TMCnet News

DesignCon 2013 to Feature Keynotes, Live Teardowns and Presentations
[January 24, 2013]

DesignCon 2013 to Feature Keynotes, Live Teardowns and Presentations


Jan 24, 2013 (Close-Up Media via COMTEX) -- UBM Tech, a daily source of business and technical information for the electronics industry's decision makers, announced it is gearing up to welcome thousands of manufacturers, engineers and industry executives to its annual DesignCon conference and expo.



According to a release, DesignCon 2013, which will take place January 28-31, in Santa Clara, Calif., will feature three keynotes, two live teardowns conducted by the hardware repair wizards of iFixit and more than 120 in-depth tutorials, technical paper sessions, training sessions and panel discussions all customized for the chip, board and systems design communities.

Replete with technical content designed to facilitate learning, networking and overall industry success, the 14-track DesignCon conference program addresses the pervasive challenge of signal integrity at all levels of electronic design. Featuring more than 130 exhibitors, an educational forum sponsored by Agilent Technologies, the annual Design Vision awards, and the Chiphead Theater, which will host two live product teardowns along with speed training demonstrations, panel discussions, the Best in Test Awards and DesignTOUR drawings, the DesignCon expo also features the in-depth and industry-specific content that adds to DesignCon's reputation as the definitive annual event for the semiconductor and electronic design engineering communities.


"We take great pride in evaluating, recruiting and facilitating the sharing of the most timely and relevant information within the chip, board and systems design communities at DesignCon each year, but are particularly excited about this year's keynote speakers, events and content," said Patrick Mannion, Content Director at UBM Tech. "DesignCon 2013 is a definite don't-miss event for the design engineering community." Bill Swift, Vice President of Engineering for the Silicon Engineering Team at Cisco Systems, will deliver the initial keynote address at 12:30 p.m. on Monday, Jan. 28, in Mission City Ballroom B.

Jonah Alben, Senior Vice President of GPU Engineering at Nvidia, will deliver DesignCon's second keynote address, which will focus on the challenges of sustaining investment in methodology to keep up with ever increasing design complexity and the promising results of one of NVIDIA's latest methodology investments, the application of GPUs to EDA, at 12 p.m. on Tuesday, Jan. 29 in Mission City Ballroom B. Lastly, at 12pm on Wednesday, Jan. 30, Mike Santori, Business and Technology Fellow at National Instruments, will deliver the third and final keynote address, in which he plans to discuss the evolution of software-designed instrumentation and its implications for new approaches to test and design.

More information: www.ubm.com ((Comments on this story may be sent to [email protected]))

[ Back To TMCnet.com's Homepage ]