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Vicor to Highlight New Power Semiconductor and System Innovation at Darnell's Power Forum 2012
ANDOVER, MA, Sep 13, 2012 (MARKETWIRE via COMTEX) --
Vicor(TM) Corporation (NASDAQ: VICR) today announced its
participation in Darnell's Power Forum 2012, the premier power
electronics industry event hosted by Darnell Group. A Platinum
sponsor of the event, Vicor will be exhibiting at booth #303 onsite
within the DoubleTree by Hilton Hotel, San Jose, California,
September 19-21.
At the event, principal engineer Chris R. Swartz will deliver a
presentation on a new zero voltage switching (ZVS) buck regulator
topology, utilized in the new Picor(R) Cool-Power(R) ZVS buck
regulators. The presentation, titled 'ZVS Buck Regulator Enables High
Performance within Point of Load Applications,' is scheduled for
Friday, September 21, from 10:45AM - 12:15PM, and will address the
inherent benefits of a ZVS buck regulator topology for board-level
designers seeking maximum power density and flexibility for high
efficiency point of load DC-DC regulation.
Vicor will be showcasing its newest power semiconductor solutions and
systems at the event. In addition to its ZVS buck regulators, the
company will feature its new Westcor(TM) MicroPAC(TM)
output-configurable AC-DC power systems, providing up to 1300 W of
continuous power at up to 92% efficiency and 25 Win3 power density
for distributed power architectures in industrial and automation,
MIL-COTS, telecom and renewable energy applications.
Vicor will also feature its direct 48V-to-processor power conversion
solutions for the datacenter, cloud computing and telecom markets.
Compliant with Intel's x86 VR12.0 voltage regulation specification,
VI Chip(R) PRM(R) non-isolated regulators and VTM(R) current
multipliers enable more efficient power distribution and eliminate
duplicate conversion stages in traditional 48V to 12V to 1V power
systems, yielding more than 5% greater overall efficiency in a
package size 3X smaller than competing offerings.
Darnell's Power Forum is a premier international event focused on
'advancing power technologies that matter' for the successful
development of next-generation power systems. Presentations and
discussions will focus on power management, energy efficiency,
advanced components, energy storage, and smart grid innovations that
are enabling practical advances in power electronics. For more
information visit http://dpf.darnell.com/index.php
Attendees can visit Vicor onsite at Darnell's Power Forum at booth
#303. To register to attend the event, please visit
http://www.darnell.com/market/product_info.php cPath=1&products_id=238
About Vicor Corporation
Headquartered in Andover, Massachusetts,
Vicor Corporation designs, manufactures and markets innovative, high
performance modular power components, from bricks to
semiconductor-centric solutions, to enable customers to efficiently
convert and manage power from the wall plug to the point-of-load.
Complementing an extensive portfolio of patented innovations in power
conversion and power distribution with significant application
development expertise, Vicor offers comprehensive product lines
addressing a broad range of power conversion and management
requirements across all power distribution architectures, including
CPA, DPA, IBA, FPA(TM) and CBA. Vicor focuses on solutions for
performance-critical applications in the following markets:
enterprise and high performance computing, telecommunications and
network infrastructure, industrial equipment and automation, vehicles
and transportation and aerospace and defense electronics.
www.vicorpower.com
Vicor, Picor, Cool-Power, Westcor, MicroPAC, VI Chip, PRM, VTM and
FPA are trademarks of Vicor Corporation.
Contact:
Iris Kimber
Vicor Corporation
978-749-3396
Email Contact
SOURCE: Vicor Corporation
http://www2.marketwire.com/mw/emailprcntct id=BAC21E7826125A0D
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