[September 08, 2012] Xilinx Assigned Patent for Integrated Circuit Assembly Having Vented Heat-spreader Tweet (Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Sept. 8 -- Xilinx, San Jose, Calif., has been assigned a patent (8,258,013) developed by four co-inventors for an "integrated circuit assembly having vented heat-spreader." The co-inventors are Kumar Nagarajan, San Jose, Calif., S. Gabriel R. Dosdos, San Jose, Calif., Dong W. Kim, San Jose, Calif., and Kong W. Lee, San Jose, Calif. The abstract of the patent published by the U.S. Patent and Trademark Office states: "An integrated circuit package assembly includes a substrate, a semiconductor die having opposing first and second surfaces, and a head-spreader. The semiconductor die is mounted on the substrate with the first surface facing the substrate. The heat-spreader includes a central region thermally coupled to the second surface of the semiconductor die, a flange region mounted on the substrate, and a side wall region between the central and flange regions. A cavity is formed between the heat-spreader, the substrate, and the semiconductor die. The heat-spreader has at least one vent extending from the cavity through the heat-spreader." The patent application was filed on Feb. 12, 2010 (Xilinx, Inc. (San Jose, CA)). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,258,013&OS=8,258,013&RS=8,258,013 Written by Satyaban Rath; edited by Hemanta Panigrahi. SR0908HP0908-782221 (c) 2012 Targeted News Service [ Back To TMCnet.com's Homepage ]