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Xilinx to Participate in Hot Chips 2012Aug 28, 2012 (Close-Up Media via COMTEX) -- Xilinx, Inc., announced its participation at Hot Chips 2012, through August 29, at the Flint Center for the Performing Arts. According to a release, Xilinx corporate VP of FPGA development and silicon technology, Liam Madden, will kick off Xilinx activities by hosting a multi-vendor tutorial on die stacking, with presentations from AMD, Amkor, Qualcomm, UMC, and Xilinx. During the tutorial, Xilinx will cover how 3D-ICs built with Xilinx stacked silicon interconnect technology are delivering capabilities that in many respects are a process generation ahead of what could otherwise be made available. Hot Chips is a semiconductor industry conference. Xilinx is a provider of all programmable FPGAs, SoCs and 3D ICs. More information: www.xilinx.com ((Comments on this story may be sent to [email protected])) |