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GainSpan extends portfolio of embedded Wi-Fi modules for Internet of ThingsMar 14, 2012 (TELECOMWORLDWIRE via COMTEX) -- Semiconductor solutions company GainSpan Corporation, which provides low power Wi-Fi and Wi-Fi connectivity for the Internet of Things, announced on Wednesday that it has extended its portfolio of of embedded Wi-Fi modules with the addition of the GS1011MIxS and GS1011MExS. According to the company, GS1011MIxS and GS1011MExS measure just 19.4 mm x 28.7 mm and are two of the smallest modules currently on the market today. The new modules are said to provide a significant reduction in footprint and offer an easy to integrate, compact and cost-effective solution for the emerging Internet of Things' applications. GainSpan Corporation said the GS1011MIxS provides low power Wi-Fi connectivity with +9dBm of transmit output power, while the GS1011MExS is an extended range solution with transmit power of +18dBm. The modules provide both UART and SPI interfaces and are pre-loaded with serial to Wi-Fi firmware with complete Wi-Fi functionality. In addition, the modules feature built-in trace or external antenna options through a U.FL connector, an industrial operating temperature range from -40 to 85 degrees Celsius and are certified or pre-certified for all major regulatory requirements including FCC, IC and ETSI. The company added that its new 36-pin, soldered down GS1011MIxS and GS1011MExS modules are sampling now and will ship in volume production in early Q2. Comments on this story may be sent to [email protected] |