(TendersInfo (India) Via Acquire Media NewsEdge) UNITED STATES : Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium
Tensilica, Inc. today announced that the second-generation multi-mode LTE/HSPA/3G (Long Term Evolution) baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP (digital signal processor) and the ConnX BBE16 Baseband DSP. As with the first generation NTT DOCOMO-sponsored design now shipping in volume in cell phones and tablets, this chip was co-developed by industry leaders Fujitsu, Panasonic and NEC.
NTT DOCOMO has been an important partner, and we are very excited about this second-generation design, which reduces the power dissipation through multi-standard integration and incorporates even more key functions for next-generation smartphones and tablets such as TD LTE, stated Eric Dewannain, Tensilica s vice president and business unit manager, baseband business unit.
First general LTE smartphones, tablets and dongles incorporating Tensilica DPUs were introduced starting at the end of 2010 and include Fujitsu s ARROWS X LTE F-05D Smartphone and ARROWS Tab LTE F-01D tablet. More LTE-based smartphones, tablets and dongles powered by Tensilica are being introduced at the Mobile World Congress show in Barcelona. NTT DOCOMO is the leading mobile phone operator in Japan and also has a strong presence internationally.
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