[February 02, 2012] Toshiba Unveils Latest MIPI Solutions for High-Resolution Displays Tweet Feb 02, 2012 (M2 PRESSWIRE via COMTEX) -- Toshiba Electronics Europe has announced that visitors to this years Mobile World Congress (MWC) in Barcelona will be the first to see new demonstrations of high-resolution display solutions built around the Mobile Industry Processor Interface (MIPI). Among the demonstrations unveiled at MWC will be support for the connection of high-resolution display panels to mobile devices using Toshibas new TC358766XBG integrated display serial interface (DSI)-to-DisplayPort bridge IC. MWC will also be the premiere for demonstrations showing the future for display applications using MIPI UniProSM high-speed interface architecture and associated UniPort-M ports. Display interfaces that use UniPort-M allow for the support of large, high-resolution display panels while keeping power consumption to a minimum. Through these demonstrations Toshiba will show that the UniProSM interface can be used for applications beyond Universal Flash Storage (UFS) and cameras. All of the demonstrations take place on the MIPI Alliance stand (7G11). The Mobile Industry Processor Interface (MIPI) Alliance is an open membership organization that includes leading companies in the mobile industry that share the objective of defining and promoting open specifications for interfaces inside mobile terminals. DisplayPort is a digital display interface developed and produced by the Video Electronics Standards Association (VESA). The interface is primarily used to connect a video source to a display device such as a computer monitor, though it can also be used to transmit audio, USB, and other forms of data. MIPI UniProSM (or Unified Protocol) is a high-speed interface technology for interconnecting integrated circuits in mobile phones or comparable products UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers. The UFS standard represents an evolutionary progression of JEDEC standards in this field, and has been specifically tailored for mobile applications and computing systems requiring high performance and low power consumption. The initial data throughput for UFS will be 300 megabytes per second (MB/s), and the standard also supports command queuing features to raise random read/write speeds. About Toshiba Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the worlds largest semiconductor vendors. TEE offers one of the industry's broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs, ASSPs and display products for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Dsseldorf, Germany, with subsidiaries in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa. Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturer and marketer of advanced electronic and electrical products spanning digital consumer products; electronic devices and components; power systems, including nuclear energy; industrial and social infrastructure systems; and home appliances. Founded in 1875, Toshiba today operates a global network of more than 490 companies, with 203,000 employees worldwide and annual sales surpassing US$77 billion. For more information visit Toshiba Electronics Europe's web site at www.toshiba-components.com Contact details for publication: Toshiba Electronics Europe, Hansaallee 181, D-40549 Dsseldorf, Germany Tel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197 Web: http://www.toshiba-components.com/pressoffice/index.asp E-mail: [email protected] Contact details for editorial enquiries: Henning Rausch, Toshiba Electronics Europe Tel: +49 (211) 5296 117 E-mail: [email protected] Issued by: Simon Flatt/Andrew Town, Pinnacle Marketing Communications Ltd, Tel: +44 (0) 20 8869 9229/+44 (0) 20 8429 6546 Fax: +44 (0) 20 8868 4373. Web: www.pinnacle-marketing.com E-mail: [email protected] or [email protected] Mobile World Congress 2012, 27th February 1st March Hall 7, Stand 7G11 ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to [email protected]. [ Back To TMCnet.com's Homepage ]