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Microsemi unveils new technology platform for 4G RF FEMsJan 18, 2012 (Datamonitor via COMTEX) -- Microsemi Corporation, a provider of semiconductor solutions, has announced a new technology platform for 4G RF front-end modules, or FEMs, based on silicon germanium, or SiGe, technology. Microsemi's new platform reportedly integrates multiple filters, switches, LNAs and power amplifiers onto a single monolithic SiGe die, and supports multiple input/multiple output (MIMO) functionality. The integration reportedly allows reductions in cost and printed circuit board footprint, which are considerations when designing devices such as smartphones and tablets. Microsemi's RF front-end-module includes two functional 2.5GHz IEEE 802.16 power amplifiers, two transmit/receive switches, two LNAs, two baluns, harmonic and noise shaping filters, and a digital interface for control and tuning. Its performance meets the 802.16 mask and EVM requirements at an output power of 24dBm in a 5x5.6mm package, the company said. Microsemi's wireless LAN dual-band FEM will be able to integrate linear 802.11ac compliant 2.4GHz and 5GHz PAs, 2.4 and 5GHz bypassable LNAs, switches, filters, a diplexer and an I2C digital interface into 3x4mm QFN package. "Microsemi has developed what we believe to be the world's first silicon germanium-based, single-chip RF front-end module platform capable of meeting the stringent requirements of 4G applications while still offering space and cost-savings," said Darcy Poulin, director of product engineering for Microsemi. "Moving forward, we will continue to innovate solutions that facilitate the growth of new industry standards such as IEEE 802.11ac." "The performance achieved with this platform is truly impressive and quite an accomplishment in the industry," said Paul Pickle, senior vice president of Microsemi. "The first-of-its-kind digital tuning capability we have designed will reduce future development times and customization efforts as we engage our baseband partners. In addition, the performance achieved will enable Microsemi to drive innovation into the latest wireless LAN standard, IEEE 802.11ac, as well as the next-generation 4G mobile standard." http://www.datamonitor.com Republication or redistribution, including by framing or similar means, is expressly prohibited without prior written consent. Datamonitor shall not be liable for errors or delays in the content, or for any actions taken in reliance thereon |