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U.S. Patents Awarded to Inventors in Idaho (Sept. 5)
[September 05, 2011]

U.S. Patents Awarded to Inventors in Idaho (Sept. 5)


(Targeted News Service Via Acquire Media NewsEdge) Targeted News Service Targeted News Service ALEXANDRIA, Va., Sept. 5 -- The following federal patents were awarded to inventors in Idaho.

*** Micron Technology Assigned Patent ALEXANDRIA, Va., Sept. 5 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,007,275) developed by Shyam Surthi, Boise, Idaho, and Scott E. Moore, Nampa, Idaho, for "methods and apparatuses for heating semiconductor wafers." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Methods and apparatuses for heat treatment of semiconductor wafers are disclosed herein. A method of heating a semiconductor wafer in accordance with one embodiment includes heating the wafer in a loading enclosure of a heat treatment system above an ambient temperature external to the loading enclosure. The method also includes moving the heated wafer from the loading enclosure into a processing enclosure of the heat treatment system. In particular embodiments, the method can further include heating a flow of purge gas above the ambient temperature and introducing the flow of heated purge gas into the loading enclosure while the wafer is in the loading enclosure. In still further embodiments, the method can include heating a flow of process gas to a processing temperature and introducing the heated flow of process gas into the processing enclosure while the wafer is in the processing enclosure." The patent application was filed on Jan. 25, 2008 (12/020,158). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,007,275.PN.&OS=PN/8,007,275&RS=PN/8,007,275 Written by Anjali Jha; edited by Jaya Anand.

*** Battelle Energy Alliance Assigned Patent ALEXANDRIA, Va., Sept. 5 -- Battelle Energy Alliance, Idaho Falls, Idaho, has been assigned a patent (8,007,607) developed by four co-inventors for a "combustible structural composites and methods of forming combustible structural composites." The co-inventors are Michael A. Daniels, Idaho Falls, Idaho, Ronald J. Heaps, Idaho Falls, Idaho, Eric D. Steffler, Idaho Falls, Idaho, and William D. Swank, Idaho Falls, Idaho.

The abstract of the patent published by the U.S. Patent and Trademark Office states: "Combustible structural composites and methods of forming same are disclosed. In an embodiment, a combustible structural composite includes combustible material comprising a fuel metal and a metal oxide. The fuel metal is present in the combustible material at a weight ratio from 1:9 to 1:1 of the fuel metal to the metal oxide. The fuel metal and the metal oxide are capable of exothermically reacting upon application of energy at or above a threshold value to support self-sustaining combustion of the combustible material within the combustible structural composite. Structural-reinforcing fibers are present in the composite at a weight ratio from 1:20 to 10:1 of the structural-reinforcing fibers to the combustible material. Other embodiments and aspects are disclosed." The patent application was filed on Sept. 19, 2008 (12/233,639). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,007,607.PN.&OS=PN/8,007,607&RS=PN/8,007,607 Written by Kusum Sangma; edited by Anand Kumar.


*** Idaho Inventor Develops Patent for Variously Adjustable Night Splint with Adjustable Spacers and Lock-out Hinge ALEXANDRIA, Va., Sept. 5 -- William S. Stano, Boise, Idaho, has developed a patent (8,007,456) for a "variously adjustable night splint with adjustable spacers and lock-out hinge." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A low cost foldable orthosis for the treatment of foot and ankle conditions including plantar facitis and tendonitis, the orthosis is a foldable molded portion manufactured in a variety of incremental sizes, having a generally U-shaped cross-sectional configuration and a flat foot bed, interconnected by a hinge. This device includes a variety of spacers which enable the angle of covered by a soft fabric covering, and using a removable and interchangeable foot bed wedge insert permitting the angle of dorsiflexion, plantar flexion, inversion and eversion to be varied." The patent application was filed on Oct. 28, 2005 (11/262,650). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,007,456&OS=8,007,456&RS=8,007,456 Written by Arpi Sharma; edited by Jaya Anand.

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