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U.S. Patents Awarded to Inventors in Arizona (Aug. 8)(Targeted News Service Via Acquire Media NewsEdge) Targeted News Service Targeted News Service ALEXANDRIA, Va., Aug. 8 -- The following federal patents were awarded to inventors in Arizona. *** Fujifilm Electronic Materials Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Fujifilm Electronic Materials, North Kingstown, R.I., has been assigned a patent (7,985,350) developed by Daniel J. Teff, Chandler, Ariz., and John L. Chagolla, Mesa, Ariz., for "additives to prevent degradation of cyclic alkene derivatives." The abstract of the patent published by the U.S. Patent and Trademark Office states: "This disclosure relates to compositions that include (a) at least one substituted or unsubstituted cyclic alkene, and (b) an antioxidant composition including at least one compound of Formula (I): ##STR00001## R.sup.1 through R.sup.4 in Formula (I) are described in the specification." The patent application was filed on Dec. 21, 2010 (12/974,090). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=79,85,350.PN.&OS=PN/79,85,350&RS=PN/79,85,350 Written by Ruby Maibam; edited by Jaya Anand. *** Materials and Electrochemical Research Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Materials and Electrochemical Research, Tucson, Ariz., has been assigned a patent (7,985,326) developed by James C. Withers, Tucson, Ariz., and Raouf O. Loutfy, Tucson, Ariz., for a "thermal and electrochemical process for metal production." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A system for purification of high value metals comprises an electrolytic cell in which an anode formed of a composite of a metal oxide of the metal of interest with carbon is electrochemically reduced in a molten salt electrolyte." The patent application was filed on Sept. 28, 2006 (11/536,599). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=79,85,326.PN.&OS=PN/79,85,326&RS=PN/79,85,326 Written by Ruby Maibam; edited by Jaya Anand. *** Propst Family Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Propst Family, Phoenix, has been assigned a patent (7,984,594) developed by John Eugene Propst, Phoenix, for a "composite building and panel systems." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A building panel structure is disclosed, in which composite building panels are used to form a structure. A composite building panel is disclosed which includes a core and a coating applied over the core. In some embodiments the core consists of a frame and one or more than one insulating structural block. The insulating structural blocks can be encapsulated polystyrene (EPS) foam blocks. In some embodiments the coating includes an inner scratch layer and an outer main brown layer. The inner scratch layer can be formed of at least two layers. The outer main brown layer can include a fiberglass mesh embedded into the outer main brown layer. A method of forming a building panel structure is disclosed which includes forming a core using a frame and one or more than block, applying an inner scratch layer to the core, and applying an outer main brown layer over the inner scratch layer." The patent application was filed on July 27, 2010 (12/844,163). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=7984594.PN.&OS=PN/7984594&RS=PN/7984594 Written by Ankresh Ranjan; edited by Jaya Anand. *** TASER International Assigned Patent ALEXANDRIA, Va., Aug. 8 -- TASER International, Scottsdale, Ariz., has been assigned a patent (7,984,579) developed by Steven N.D. Brundula, Chandler, Ariz., Magne H. Nerheim, Paradise Valley, Ariz., and Milan Cerovic, Phoenix, for "systems and methods for electronic weaponry that detects properties of a unit for deployment." The abstract of the patent published by the U.S. Patent and Trademark Office states: "An electronic weapon, when combined with a unit for deployment, causes skeletal muscle contractions in a human or animal target. According to the present invention, a launch controller for an electronic weapon includes a detector, a stimulus signal generator, and a switch. When the switch is conducting, it completes a circuit in combination with a unit for deployment. The circuit, when completed, operates a propellant of the unit for deployment to deploy at least two electrodes of the unit for deployment to enable the stimulus signal generator to deliver through the target a stimulus current to incapacitate the target by causing contractions of the skeletal muscles of the target. The detector is coupled to the switch and detects whether the switch is conducting prior to combining the unit for deployment and the electronic weapon." The patent application was filed on April 30, 2008 (12/113,107). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=7984579.PN.&OS=PN/7984579&RS=PN/7984579 Written by Ankresh Ranjan; edited by Jaya Anand. *** Motor Excellence Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Motor Excellence, Flagstaff, Ariz., has been assigned a patent (7,989,084) developed by Thomas Janecek, Flagstaff, Ariz., for a "powdered metal manufacturing method and devices." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A powdered metal assembly includes a mechanical part, a powdered metal part and a fastener configured to join the mechanical part and the powdered metal part. In another aspect of the disclosure, a method for manufacturing a powdered metal assembly may include the steps of positioning the mechanical part in a forming apparatus, providing a powdered metal into the forming apparatus, compressing the powdered metal to form and bond a powdered metal part to the mechanical part to form the powdered metal assembly, and removing the powdered metal assembly from the forming apparatus." The patent application was filed on May 9, 2008 (12/149,933). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,989,084&OS=7,989,084&RS=7,989,084 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** SmartHealth Assigned Patent ALEXANDRIA, Va., Aug. 8 -- SmartHealth, Phoenix, has been assigned a patent (7,985,483) developed by Karl-Michael Klenk, Mesa, Ariz., for "digital printing of low volume applications." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of coating low density polyethylene (LDPE) and linear low density polyethylene (LLDPE), or combinations of the two, is disclosed. The method includes treating the polyethylene with a coating and then digitally printing the coated polyethylene substrate. The coated substrate may then be over-coated to protect the printing and the substrate may be formed as desired. The coated substrate may also be coated with a clear thin protective coating and heat-sealed on three sides to form a small tote bag." The patent application was filed on Nov. 16, 2006 (11/560,623). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,483.PN.&OS=PN/7,985,483&RS=PN/7,985,483 Written by Anjali Jha; edited by Jaya Anand. *** Dow Corning Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Dow Corning, Midland, Mich., has been assigned a patent (7,989,030) developed by four co-inventors for a "silicone resin and silicone composition." The co-inventors are Ronald Boisvert, Chandler, Ariz., Duane Bujalski, Auburn, Mich., Zhongtao Li, Midland, Mich., and Kai Su, Midland, Mich. The abstract of the patent published by the U.S. Patent and Trademark Office states: "A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film." The patent application was filed on July 23, 2007 (12/375,436). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,989,030&OS=7,989,030&RS=7,989,030 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Honeywell International Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Honeywell International, Morristown, N.J., has been assigned a patent (7,989,020) developed by Thomas E. Strangman, Prescott, Ariz., Derek Raybould, Denville, N.J., and Devlin M. Gualtieri, Ledgewood, N.J., for a "method of forming bond coating for a thermal barrier coating." The abstract of the patent published by the U.S. Patent and Trademark Office states: "According to a method for forming a coating system on a turbine engine component substrate that comprises a nickel-based superalloy substrate having at least one refractory metal included therein, a nickel-based layer is formed on the substrate, the nickel-based layer comprising at least one active material selected from the group consisting of elemental silicon and a silicon compound. The at least one active material is then diffused into the substrate. An yttrium-modified platinum aluminide bond coating, or a MCrAlX bond coating, may be then formed over the active material-modified nickel-based layer." The patent application was filed on Feb. 8, 2007 (11/703,964). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,989,020&OS=7,989,020&RS=7,989,020 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Anthem Leather Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Anthem Leather, High Point, N.C., has been assigned a patent (7,989,051) developed by Andres Gabriel Moresco, Buenos Aires, Ariz., Washington Adhemar Perez Igiel, Buenos Aires, Ariz., and Juan Maria Serrano, Buenos Aires, Ariz. for a magnetic modular coating. The abstract of the patent published by the U.S. Patent and Trademark Office states: "This invention relates to a magnetic modular coating for floors and walls, even in wet sites and under water, that is composed of a sole fixing element laid between a magnetic adherence decorative plate and a metallic framework structure (3). Such coating also includes a bi-directional magnetic adherence layer (4) of minimum thickness; a decorative surface layer (5), and an upper rigidifying sheet (6) made up of a laminar unit. Adhesives used can be of any kind suitable to join components together. The modules allow for a fast installation, are easily removable and can be re-used." The patent application was filed on Jan. 13, 2005 (11/813,880). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,989,051&OS=7,989,051&RS=7,989,051 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Intel Assigned Patent for Method of Forming Collapse Chip Connection Bumps on a Semiconductor Substrate ALEXANDRIA, Va., Aug. 8 -- Intel, Santa Clara, Calif., has been assigned a patent (7,985,622) developed by four co-inventors for a "method of forming collapse chip connection bumps on a semiconductor substrate." The co-inventors are Ravi Nalla, Chandler, Ariz., Islam Salama, Chandler, Ariz., Charan Gurumurthy, Higley, Ariz., and Hamid Azimi, Chandler, Ariz. The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of forming collapse chip connection bumps on a semiconductor substrate is provided. The method includes providing a semiconductor substrate having a plurality of bump vias on a top surface of the semiconductor substrate and electroplating the plurality of bump vias to form a plurality of via pads on the top surface of the semiconductor substrate. The method also includes disposing a plurality of solder microballs on the top surface of the semiconductor substrate, wherein each solder microball is placed on a corresponding via pad on the semiconductor substrate and reflowing the plurality of solder microballs to form the collapse chip connection bumps on the semiconductor substrate." The patent application was filed on Aug. 20, 2008 (12/195,339). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,622&OS=7,985,622&RS=7,985,622 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Intel Assigned Patent for Thermal Intermediate Apparatus, Systems, and Methods ALEXANDRIA, Va., Aug. 8 -- Intel, Santa Clara, Calif., has been assigned a patent (7,985,627) developed by four co-inventors for "thermal intermediate apparatus, systems, and methods." The co-inventors are Bryan M. White, Katy, Texas, Paul A. Koning, Chandler, Ariz., Yuegang Zhang, Cupertino, Calif., and C.M. Garner, Pleasanton, Calif. The abstract of the patent published by the U.S. Patent and Trademark Office states: "Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers." The patent application was filed on Nov. 24, 2008 (12/277,075). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,627&OS=7,985,627&RS=7,985,627 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Ortho-clinical Diagnostics Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Ortho-Clinical Diagnostics, Raritan, N.J., has been assigned a patent (7,988,972) developed by four co-inventors for "immunoreactive peptides from Epstein-Barr virus." The co-inventors are Richard S. Smith, Salt Lake City, Gary R. Pearson, Sedona, Ariz., D. Elliot Parks, Del Mar, Calif., and Susan Pothen Varghese, Melrose, Mass. The abstract of the patent published by the U.S. Patent and Trademark Office states: "The Epstein-Barr virus (EBV) specific polypeptides ETFTETWNRFITHTE (SEQ. ID NO: 1), GMLEASEGLDGWIHQ (SEQ. ID NO:2), HQQGGWSTLIEDNIP (SEQ. ID NO:3), and KQKHPKKVKQAFNPL (SEQ. ID NO:4) are among those disclosed. Also disclosed are the use of these polypeptides for the production of polypeptide-specific antibodies and the diagnosis and treatment of EBV-associated disease." The patent application was filed on Dec. 14, 2007 (11/957,251). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,972&OS=7,988,972&RS=7,988,972 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Karsten Manufacturing Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Karsten Manufacturing, Phoenix, has been assigned a patent (7,988,564) developed by Marty R. Jertson, Phoenix, for "golf clubs with progressive tapered face thicknesses." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Embodiments of a golf club set with progressive tapered face thickness coordinated with club loft are generally described herein. Other embodiments may be described and claimed." The patent application was filed on Dec. 19, 2008 (12/340,523). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,564.PN.&OS=PN/7,988,564&RS=PN/7,988,564 Written by Anjali Jha; edited by Jaya Anand. *** Freescale Semiconductor Assigned Patent for Semiconductor Device with a Controlled Cavity and Method of Formation ALEXANDRIA, Va., Aug. 8 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (7,985,659) developed by Scott M. Hayes, Chandler, Ariz., and Dwight L. Daniels, Phoenix, for a "semiconductor device with a controlled cavity and method of formation." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method for forming a semiconductor device includes providing a first cap wafer having a first opening extending through the first cap wafer, and a second cap wafer bonded to the first cap wafer, wherein the second cap wafer has a second opening extending through the second cap wafer, and wherein the first opening is misaligned with respect to the second opening. After the providing the first cap wafer and second cap wafer, the second cap wafer is bonded to a device wafer, wherein a cavity is formed between the device wafer and the second cap wafer, and wherein the device wafer comprises at least one semiconductor device in the cavity. After the bonding the second cap wafer to the device wafer, a vacuum is applied, wherein during the applying the vacuum, a sealing layer is formed over the first cap wafer, wherein the sealing layer seals the first opening." The patent application was filed on March 31, 2010 (12/750,929). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,659&OS=7,985,659&RS=7,985,659 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Research Development Foundation Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Research Development Foundation, Carson City, Nev., has been assigned a patent (7,985,435) developed by six co-inventors for a "triterpene compositions and methods for use thereof." The co-inventors are Charles J. Arntzen, Ithaca, N.Y., Mary E. Blake, Tucson, Ariz., Jordan U. Gutterman, Houston, Joseph J. Hoffmann, Tucson, Ariz., Gamini S. Jayatilake, Broomfield, Colo., and David T. Bailey, Boulder, Colo. The abstract of the patent published by the U.S. Patent and Trademark Office states: "The invention provides saponin mixtures and compounds which are isolated from the species Acacia victoriae and methods for their use. These compounds may contain a triterpene moiety, such as acacic or oleanolic acid, to which oligosaccharides and monoterpenoid moieties are attached. The mixtures and compounds have properties related to the regulation of apoptosis and cytotoxicity of cells and exhibit potent anti-tumor effects against a variety of tumor cells." The patent application was filed on Jan. 15, 2010 (12/688,651). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,435.PN.&OS=PN/7,985,435&RS=PN/7,985,435 Written by Anjali Jha; edited by Jaya Anand. *** Black & Decker Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Black & Decker, Newark, Del., has been assigned a patent (7,988,538) developed by eight co-inventors for a large angle grinder. The co-inventors are Paul K. Trautner, Baltimore, Philip T. Miller, Phoenix, Kevin S. Agan, Fallston, Md., Erik Ekstrom, Woodstock, Md., Junyi Xie, Wuxi, China, Yaping Yang, Suzhou, China, Jason Melvin, Baltimore, and Gregg L. Sheddy, Shrewsbury, Pa. The abstract of the patent published by the U.S. Patent and Trademark Office states: "An angle grinder is provided including a radial fan assembly. The radial fan assembly is configured to direct exhaust radially outwardly and axially away from a user of the angle grinder. Brush card assemblies for an angle grinder are also provided. The brush card assemblies provide for the securing of brush cards to a field case of the angle grinder by the interface between the field case and brush cards. Additionally, a spindle lock mechanism and a safety mechanism for an angle grinder are provided." The patent application was filed on Oct. 13, 2006 (11/549,264). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,538.PN.&OS=PN/7,988,538&RS=PN/7,988,538 Written by Anjali Jha; edited by Jaya Anand. *** Semiconductor Components Industries Assigned Patent for Semiconductor Die Singulation Method ALEXANDRIA, Va., Aug. 8 -- Semiconductor Components Industries, Phoenix, has been assigned a patent (7,985,661) developed by Gordon M. Grivna, Mesa, Ariz., for a "semiconductor die singulation method." The abstract of the patent published by the U.S. Patent and Trademark Office states: "In one embodiment, semiconductor die are singulated from a semiconductor wafer by etching openings completely through the semiconductor wafer." The patent application was filed on March 29, 2010 (12/749,370). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,661&OS=7,985,661&RS=7,985,661 Written by Satyaban Rath; edited by Hemanta Panigrahi. *** Hexcel Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Hexcel, Dublin, Calif., has been assigned a patent (7,988,809) developed by four co-inventors for an "aircraft floor and interior panels using edge coated honeycomb." The co-inventors are Lance Smith, Pleasanton, Calif., Yen-Seine Wang, San Ramon, Calif., Robert Morrison, Phoenix, and Clark Smith, Phoenix. The abstract of the patent published by the U.S. Patent and Trademark Office states: "Aircraft floor and interior panels where core-skin bonding is improved between honeycomb and composite face sheets (skins) by applying a polyamide and/or rubber-containing adhesive to the edge of the honeycomb prior to bonding. Edge coating of the honeycomb allows one to reduce panel weight without reducing the performance parameters that are required for different types of aircraft floor and interior panels." The patent application was filed on June 20, 2006 (11/471,078). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,809.PN.&OS=PN/7,988,809&RS=PN/7,988,809 Written by Arpi Sharma; edited by Jaya Anand. *** DePuy Spine Assigned Patent ALEXANDRIA, Va., Aug. 8 -- DePuy Spine, Raynham, Mass., has been assigned a patent (7,988,698) developed by four co-inventors for a spinal rod approximator. The co-inventors are William S. Rosenberg, Overland Park, Kan., Thomas V. Doherty, Hesperia, Calif., Mark C. Boomer, Phoenix, and Bryan S. Jones, West Roxbury, Mass. The abstract of the patent published by the U.S. Patent and Trademark Office states: "Spinal implants, spinal rod approximators for seating a stabilizing rod in a rod-receiving portion of a spinal implant, and methods for using the same are provided. In one embodiment, a spinal rod approximator is provided including an elongate member having a grasping member formed on a distal end thereof, and a rod pusher member slidably mated to or mounted on the elongate member. The grasping member is effective to grasp a portion of a spinal implant, and the pusher member is effective to grasp and engage a stabilizing rod and push the rod into a rod-receiving portion of the spinal implant being grasped by the grasping member." The patent application was filed on Jan. 28, 2003 (10/352,687). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,698&OS=7,988,698&RS=7,988,698 Written by Arpi Sharma; edited by Jaya Anand. *** W.L. Gore & Associates Assigned Patent ALEXANDRIA, Va., Aug. 8 -- W.L. Gore & Associates, Flagstaff, Ariz., has been assigned a patent (7,988,690) developed by Andrzej J. Chanduszko, Chandler, Ariz., David R. Widomski, Wakefield, Mass., and Carol A. Devellian, Topsfield, Mass., for a "welding systems useful for closure of cardiac openings." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A welding element is provided for applying heat, chemicals, pressure, or any combination thereof to tissues inside a patient's body, e.g., a patent foramen ovale. In one aspect, the welding element is connected to a radio frequency energy source and includes an electrode and a locator. The locator facilitates positioning of the welding element and is capable of moving from an open position to a clamping position. In another aspect, a needle is provided for transseptal puncturing before the application of heat. In yet another aspect, the welding element is configured as a coil. The welding element can be made of Nitinol." The patent application was filed on Jan. 27, 2005 (11/044,657). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,690&OS=7,988,690&RS=7,988,690 Written by Arpi Sharma; edited by Jaya Anand. *** Intel Assigned Patent for Methods for Concealing Surface Defects ALEXANDRIA, Va., Aug. 8 -- Intel, Santa Clara, Calif., has been assigned a patent (7,985,957) developed by Sergei Voronov, Chandler, Ariz., for "methods for concealing surface defects." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Methods for removing random or uncontrolled surface defects from a work piece surface are provided, by applying a plurality of induced controlled defects over the random defects to alter the surface texture." The patent application was filed on Dec. 24, 2008 (12/317,523). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,957&OS=7,985,957&RS=7,985,957 Written by Arpi Sharma; edited by Jaya Anand. *** Nano Materials International Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Nano Materials International, Tucson, Ariz., has been assigned a patent (7,988,758) developed by Sion M. Pickard, Tucson, Ariz., James C. Withers, Tucson, Ariz., and Raouf O. Loutfy, Tucson, Ariz., for a "high thermal conductivity metal matrix composites." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interactive SiC surface layer on diamond particles. The interactive surface converted SiC coated diamond particles are then disposed into a mold and between the particles and permitted to rapidly solidify under pressure. The surface conversion interactive SiC coating on the diamond particles achieves minimal interface thermal resistance with the metal matrix which translates into good mechanical strength and stiffness of the composites and facilitates near theoretical thermal conductivity levels to be attained in the composite. Secondary working of the diamond metal composite can be performed for producing thin sheet product." The patent application was filed on Jan. 15, 2010 (12/688,454). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,988,758.PN.&OS=PN/7,988,758&RS=PN/7,988,758 Written by Arpi Sharma; edited by Jaya Anand. *** HVVi Semiconductors Assigned Patent ALEXANDRIA, Va., Aug. 8 -- HVVi Semiconductors, Phoenix, has been assigned a patent (7,985,977) developed by Bishnu Prasanna Gogoi, Scottsdale, Ariz., and David William Wolfert Jr., Tempe, Ariz., for a "sacrificial pillar dielectric platform." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Briefly, in accordance with one or more embodiments, a dielectric platform is at least partially formed in a semiconductor substrate and extending at least partially below a surface of a semiconductor substrate. The dielectric platform may include structural pillars formed by backfilling a first plurality of cavities etched in the substrate, and a second plurality of cavities formed by etching away sacrificial pillars disposed between the structural pillars. The second plurality of cavities may be capped to hermetically seal the second plurality of cavities to impart the dielectric constant of the material contained therein, for example air, to the characteristic dielectric constant of the dielectric platform. Alternatively, the second plurality of cavities may be backfilled with a material having a lower dielectric constant than the substrate, for example silicon dioxide where the substrate comprises silicon." The patent application was filed on Dec. 9, 2008 (12/330,765). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,977&OS=7,985,977&RS=7,985,977 Written by Arpi Sharma; edited by Jaya Anand. *** Raytheon Assigned Patent ALEXANDRIA, Va., Aug. 8 -- Raytheon, Waltham, Mass., has been assigned a patent (7,985,965) developed by Delmar L. Barker, Tucson, Ariz., William R. Owens, Tucson, Ariz., and Ross D. Rosenwald, Tucson, Ariz., for a "quantum computing device and method including qubit arrays of entangled states using negative refractive index lenses." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A quantum computing device and method employs qubit arrays of entangled states using negative refractive index lenses. A qubit includes a pair of neutral atoms separated by or disposed on opposite sides of a negative refractive index lens. The neutral atoms and negative refractive index lens are selectively energized and/or activated to cause entanglement of states of the atoms. The quantum computing device enjoys a novel architecture that is workable and scalable in terms of size and wavelength." The patent application was filed on March 29, 2007 (11/693,405). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=7,985,965&OS=7,985,965&RS=7,985,965 Written by Arpi Sharma; edited by Jaya Anand. For more information about Targeted News Service products and services, please contact: Myron Struck, editor, Targeted News Service LLC, Springfield, Va., 703/304-1897; [email protected]; http://targetednews.com. -1056952 (c) 2011 Targeted News Service |