TMCnet News
Broadcom Unveils BCM21553 HSUPA Baseband Processor and BCM2091Rradio Frequency Transceiver![]() By Nathesh TMCnet Contributor Broadcom, a provider of semiconductors for wired and wireless communications, has unveiled a new single-chip HSPA (high-speed packet access) baseband processor and a radio frequency (RF) transceiver built on the company’s 65 nanometer CMOS process.
The new solutions are designed to help manufacturers make low cost, low power, next generation 3G HSUPA phones with innovative features, sleek form factors and very long battery life. The solutions integrate all of the key 3G (third generation) cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments. The new BCM21553 HSUPA baseband processor makes use of an integrated ARM11 processor and is capable of running new apps and download media files at higher speeds paving way for sophisticated and affordable handsets and an enhanced smartphone experience. The powerful graphics core built into the BCM21553 baseband processor is based on Broadcom's (News - Alert) advanced multimedia technology, providing video support up to HVGA quality, an 8 megapixel camera, and the ability to encode and decode H.264 video at 30 fps. The BCM2091 is a highly integrated RF cellular transceiver for multi-mode (EDGE/GPRS/GSM and WCDMA/HSDPA/HSUPA) and multi-band (850/900/1800/1900/2100 MHz) applications. The device operates in any of the 3GPP bands I-X (with the exception of band VII) and can be configured to interface with single-chain or multi-chain, multi-mode Power Amplifiers (Pas). It supports HSDPA and HSUPA and up to multi-slot class 3G EGPRS operation. The RF transceiver provides RF connectivity for Broadcom's BCM21553 HSUPA processor and delivers a highly flexible transceiver architecture that provides handset designers with ultimate flexibility in PCB board design and reduces external RF engine component count, which in turn, reduces bill-of-materials (BoM) cost. In a release, Jim Tran, vice president and general manager of Broadcom's Mobile Communications line of business said these newly released solutions will enable a new generation of increasingly affordable handsets that will offer the fastest cellular connectivity available, as well as the most popular smartphone features including wireless connectivity and diverse mobile application. Recently Broadcom announced new multi-format HD Euro and SiTel collaborated with Broadcom on first single-chip ADSL2+ IAD. Nathesh is a contributing editor for TMCnet. To read more of Nathesh's articles, please visit his columnist page. Edited by Patrick Barnard |

