[November 13, 2009] siXis Offers New Embedded Computing Modules Tweet Nov 13, 2009 (Close-Up Media via COMTEX) -- siXis, a provider of advanced Silicon Circuit Board (SiCB) technology, said that it is responding to broad industry demand for increased compute density and performance at lower power with a new line of embedded computing modules (ECM). Currently the siXis product line includes two off-the-shelf high performance ECMs, the SXM100 and SXM220, and an evaluation tool, the SXM100 Development Board. Each of the modules takes advantage of siXis' patent-pending SiCB technology, which combines bare-die and passive components on large-area silicon substrates. The company also offers custom variations including different CPUs, FPGAs, memory, and oscillators - all in smaller packaging that uses up to 25 percent less power than traditional alternatives, according to the company. "These modules open up a new world of possibilities for advanced electronics manufacturers," said John Goehrke, President and CEO of siXis. "Our approach delivers an alternative to expensive ASIC developments with unique performance and power advantages for integrating memory and logic." The SXM100 enhances a Xilinx Virtex-5 XC5VLX220T FPGA by integrating dual 1Gbit DDR2 memories, bypassed power distribution, and local oscillators in the same footprint as the FPGA. The SXM100 Development Board is an evaluation tool for the SXM100. It supports industry standard interfaces for networking, video, and system configuration and allows customers to evaluate the architecture of the SXM100. The SXM220 increases memory bandwidth and reduces power consumption by integrating an Altera Stratix IV FPGA and 8 Gbits of DDR3 memory, two local oscillators and bypassed power distribution. "There are multiple, quantifiable advantages to our SiCB-based ECMs," said siXis Vice President of Engineering, David Blaker. "We flip-chip attach bare die devices to a large-area passive silicon substrate resulting in a subsystem that's reduced in size by a factor of two to three. This provides the additional benefit of reducing the complexity of the underlying PCB while simultaneously lowering the module sub-system power dissipation on the order of 25 percent." The SXM100 Embedded Computing Module and SXM100 Development Board engineering samples are available with a delivery of eight to ten weeks ARO. Engineering samples of the SXM220 Embedded Computing Module will be available starting in June 2010. ((Comments on this story may be sent to [email protected])) [ Back To TMCnet.com's Homepage ]