[October 07, 2009] Reportlinker Adds Femtocell Teardown Report Tweet NEW YORK --(Business Wire)-- Reportlinker.com announces that a new market research report is available in its catalogue. Femtocell (News - Alert) Teardown Report http://www.reportlinker.com/p0133276/Femtocell-Teardown-Report.html Abstract: New report within its proprietary DNA-I series, a Vodafone (News - Alert) Access Gateway W-CDMA 2100MHz BSR Femtocell unit." "As this unit was recently launched at the beginning of July in the UK, we were curious to understand how this product compared to CDMA femtocells that have been launched in the US by Sprint and Verizon (News - Alert) Wireless. The design is much simpler and the level of integration is significantly higher. Our biggest concern is the disparate pricing that Vodafone has established between retail consumers and enterprise customers for this product in the UK. The difference is roughly twice the price in local currency for enterprise customers," said founder and President, Earl Lum. The author has recently released a femtocell report titled Global Femtocell Market Analysis and Forecast, 1st Edition, 2008-2013 that provides a detailed RF analysis and discussion of macrocell-femtocell RF interference and handover challenges for the mobile network and handsets. "We are excited to have the opportunity to showcase this unit as well as power amplifiers, transceivers, remote radio heads, femtocells and base stations from other wireless equipment OEMs as part of our DNA-I program," says Lum. The following semiconductor & passive component suppliers are included in this report: - Analog Device, - Epcos AG, - Hynix Semiconductor, - IDT, - Intersil, - Lattice Semiconductor, - Marvell Semiconductor, - Maxim Integrated Products (News - Alert), - Micron Technology, - Murata Manufacturing, - ON Semiconductor, - SAGEM Communications, - Skyworks Solutions, - Texas Instruments, - Xilinx (News - Alert) Semiconductor. TABLE OF CONTENTS EXECUTIVE SUMMARY .......5 Active/Passive Component Summary 5 Important Note: .... 5 CHAPTER 1: W-CDMA/HSPA FEMTOCELL ......6 1.1 Overview of Femtocell Overlay ... 6 CHAPTER 2: VODAFONE ACCESS GATEWAY ......8 2.1 Product Analysis ....... 8 2.2 Mechanical Analysis .10 2.3 System Architecture Analysis ....13 CHAPTER 3: FEMTOCELL.. 15 APPENDIX A - PASSIVE CASE SIZE ANALYSIS.. 33 APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS ...... 35 List of Tables Table 1: Area A Bill of Materials ..... 19 Table 2: Area B Bill of Materials ..... 21 Table 3: Area C Bill of Materials ..... 23 Table 4: Area D Bill of Materials ..... 25 Table 5: Area E Bill of Materials ..... 27 Table 6: Area F Bill of Materials ..... 29 Table 7: SAGEM Communications GSM/GPRS Module Bill of Materials . 32 Table 8: Active/Passive Component Distribution by System Subsection....... 33 Table 9: Passive Component Case Size Distribution by System Subsection (con't) 34 Table 10: Active Semiconductor Vendor Distribution by System Subsection. 36 List of Exhibits Exhibit 1: Femtocell Overlay Deployment with Macrocell Underlay Network Diagram ……7 Exhibit 2: Vodafone Access Gateway Product…..8 Exhibit 3: BSR Femto Front Cover, External and Internal Views . 10 Exhibit 4: BSR Femto Rear Cover, External and Internal Views .. 11 Exhibit 5: BSR Femto Internal Case, Front and Rear Views 11 Exhibit 6: BSR Femto, Front and Rear Views … 12 Exhibit 7: BSR Femto PCB, Top View …… 13 Exhibit 8: BSR Femto PCB, Bottom View . 14 Exhibit 9: BSR Femtocell PCB, Top View.. 16 Exhibit 10: BSR Femtocell PCB, Bottom View… 17 Exhibit 11: Area A Component Diagram.. 18 Exhibit 12: Area B Component Diagram.. 20 Exhibit 13: Area C Component Diagram.. 22 Exhibit 14: W-CDMA TRx Block Diagram . 22 Exhibit 15: Area D Component Diagram.. 24 Exhibit 16: Area E Component Diagram.. 26 Exhibit 17: Area F Component Diagram .. 28 Exhibit 18: SAGEM Communications GSM/GPRS Module w/ Shield…… 30 Exhibit 19: SAGEM Communications GSM/GPRS Module Component Diagram…… 31 Exhibit 20: SAGEM Communications GSM/GPRS Module PCB, Bottom View . 31 Exhibit 21: Passive Component Case Size Distribution …… 33 Exhibit 23: Active Semiconductor Component Share. 35 Exhibit 24: Active Semiconductor Market Share by Vendor 37 Exhibit 25: IC (>8 pin) vs. Discrete Active Semiconductor Share ……. 37 Exhibit 26: High Pin Count (64+) Active Semiconductor Market Share by Vendor. 38 To order this report: Femtocell Teardown Report http://www.reportlinker.com/p0133276/Femtocell-Teardown-Report.html More market research reports here! [ Back To TMCnet.com's Homepage ]