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Symwave Demos USB 3.0 Physical Layer Device
[November 21, 2008]

Symwave Demos USB 3.0 Physical Layer Device


(Wireless News Via Acquire Media NewsEdge)
Symwave, a semiconductor supplier of high-performance
analog/mixed-signal connectivity solutions for the PC, consumer and
mobile devices, announced it demonstrated "the world's first physical
layer device (PHY) designed specifically to comply with the USB 3.0
specification."

According to the company, the live demonstration, at full 5Gbps speed,
is 10 times faster than today's fastest USB devices, and was conducted
at the same time as the first public release of the Revision 1.0
Specification at the SuperSpeed USB Developers Conference at the
Doubletree Hotel in San Jose, California. Symwave said that SuperSpeed
USB is backwards compatible with over 10 billion USB devices shipped
to-date, but enables up to 10 times faster connections, while also
improving power consumption. The USB 3.0 contributors group comprises
over 200 companies including brands in consumer electronics, mobile
devices, storage, and PCs.

"With more than 2.6 Billion USB ports shipped in 2007 alone, the market
opportunity for USB 3.0 should eclipse all other wired interconnect
technologies combined," said Brian O'Rourke, senior analyst with
In-Stat. "According to our April-2008 report titled Wired USB 2008:
SuperSpeed is Coming, the expected compounded annual growth rate for
USB 3.0 from 2009-2012 is over 100 percent, reaching over 500,000,000
devices in 2012. The public release of the Revision 1.0 specification
today and the actual silicon availability from Symwave are two
catalysts for the rapid market adoption we projected."

"It is a strong endorsement of SuperSpeed USB and the contributors'
group involvement to see such early SuperSpeed USB development taking
place," said Jeff Ravencraft, USB-IF president and chairman. "Symwave's
participation in the USB ecosystem will support the broad adoption of
SuperSpeed USB."

"Symwave is delighted to achieve the world's first public demonstration
of a USB 3.0 PHY device," said Yossi Cohen, President and CEO of
Symwave. "This is an amazing achievement by our engineering team, and
underscores our mixed-signal core competency. Symwave is focused on
delivering state-of-the-art USB 3.0 semiconductor solutions that will
enable consumers to enjoy up to 10 times speed improvement in every
consumer, storage, and connectivity device."


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Copyright ? 2008 Wireless News

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