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DesignCon 2006 Exhibitor ProfilesSANTA CLARA, Calif. --(Business Wire)-- Feb. 2, 2006 -- DesignCon 2006 takes place 06 - 09 Feb. at the Santa Clara Convention Center. For in-depth information about the event visit http://www.designcon.com/2006/. Below are profiles from DesignCon 2006 exhibitors; breaking news releases are available at http://www.tradeshownews.com, Business Wire's trade show, conference, and event news resource. Business Wire is the official news wire service for DesignCon 2006. -0- *T Company: CAD DESIGN SOFTWARE Booth/Stand: 809 Media Contact: Gordon Jensen Phone: 408.436.1340 E-mail: [email protected] Web: www.cad-design.com If you're not using real 3D layout software when designing IC packages, you're wasting your time and your company's money. CAD Design Software's true 3D IC Package Design tools integrate 3D Bondwire Optimization and 3D DRC into your high performance SiP layout process (Stacked Die, Stacked Packages, uBGA(TM), Flip-Chip, Advanced Hybrid/MCM, CSP, etc.). With the most advanced set of custom DRC rules available, and multiple data outputs, you will dramatically reduce overall design time and improve manufacturing yield, saving you time, and your company money. Just released: Version 7.4CAD Design Software. Helping you work smarter, not harder. Company: Cadence Design Systems, Inc. Booth/Stand: 427 Ticker Symbol & Exchange: NASDAQ:CDNS Media Contact: Bruce Chan Investor Relations Contact: Jennifer Jordan Phone: 408.943.1234 Web: www.cadence.com Cadence enables global electronic-design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, printed circuit boards and systems used in consumer electronics, networking and telecommunications equipment, and computer systems. Cadence reported 2004 revenues of approximately $1.2 billion, and has approximately 5,000 employees. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information is available at www.cadence.com. Company: Carbon Design Systems Media Contact: Georgia Marszalek Phone: 650 345 7477 E-mail: [email protected] Web: www.carbondesignsystems.com Carbon delivers a high-performance virtual system prototyping solution, VSP, that enables a system prototype to be rapidly assembled and functionally validated on the desktop months before silicon. Carbon's new software approach allows multiple levels of abstraction to be validated together including C, SystemC, Verilog and VHDL RTL, IP cores, transaction-level, and instruction-level models. The key to VSP is silicon accuracy and performance; the ability to execute billions of cycles and boot embedded operating systems, all with desktop software. The company is headquartered at 375 Totten Pond Road, Suite 100/200, Waltham, MA. 02451. Telephone: +1.781.890.1500, Fax: +1.781.890.1711, Email: [email protected] Company: CAST, Inc. Booth/Stand: 913 Media Contact: Paul Lindemann Phone: 603-434-3534 E-mail: [email protected] Web: www.cast-inc.com CAST offers 100 different IP cores, from basic processors and standard interfaces to the latest applications. At DesignCon we're announcing a new, highly configurable 8051 core that allows designers to tailor this venerable embedded processor to their specific technology or application requirements. We're also featuring live demos of cores for two very-fast growing technologies: our PCI Express Endpoint Controller and H.264 Video Encoder. In addition, our newest partners SoC Solutions will be on hand to help demo our step up from individual cores, Pre-integrated IP (PiP) platforms combining multiple cores and essential software for rapidly developing ARM(R)-based systems. Company: Centellax Booth/Stand: 126 Media Contact: Raj Savara Phone: 503 701-4338 E-mail: [email protected] Web: www.centellax.com Centellax delivers low-cost, high-performance test instruments, test accessories, and electronic components for high-speed communication and signal integrity applications. Centellax key products include a 10G BERT, both 10G and 40G PRBS generators, and ultra-broadband amplifier modules. The TG1B1A 10G BERT is small size, yet a high performance box targeted at manufacturing test for automated Bit Error Rate Testing on PCB, Optical components, andelectrical connectors. Centellax Inc. 451 Aviation Blvd. Suite 101 Santa Rosa, CA 95403-1069 ph707 568-5900 fx707 568-7647 www.centellax.com Company: Giga Scale IC Media Contact: Georgia Marszalek Phone: 650 345 7477 E-mail: [email protected] Web: www.gigaic.com Founded in 2003 in Cupertino, Calif., Giga Scale IC develops and markets InCyte, a chip estimation tool which dramatically reduces the risk, design time, and cost of IC design. It accurately estimates key IC specifications, including size, power, leakage, yield, and cost. InCyte users enter a specification through the tool's intuitive interface and, within seconds, InCyte generates an estimated floorplan and a complete datasheet. InCyte's chip estimates are accurate to within ninety-five percent of final silicon. Since the February 2005 launch of www.ChipEstimate.com, the Web distribution portal for InCyte, the user community has grown to more than 4,000 members, who have estimated more than 20,000 chip designs. Company: iRoC Technologies Booth/Stand: 715 Media Contact: Olivier Lauzeral Investor Relations Contact: Eric Dupont Phone: (408) 982 9993 E-mail: [email protected] Web: www.iroctech.com iRoC Technologies Corporation is one of the world's leading commercial providers of soft error solutions for integrated circuits (ICs). iRoC provides soft error testing (SERTEST(TM)), optimization tools (TFIT(TM), SoCFIT(TM)), and protection services (SERPRO(TM)) that help semiconductor companies estimate the reliability risks of soft errors and eliminate them during the chip design process. Caused by atmospheric radiation and packaging impurities, soft errors have historically been a major concern for aerospace and aviation markets, and are now also the fastest growing reliability problem for semiconductors. Company: Magma Design Automation Booth/Stand: 618 Ticker Symbol & Exchange: LAVA - NASDAQ Media Contact: Monica Marmie, Dir Marcom 408-565-7689 Investor Relations Contact: Milan Lazich, VP Corp Mrktg 408-565-7706 Phone: 408-565-7500 E-mail: [email protected] Web: www.magma-da.com Magma's software for integrated circuit (IC) design is recognized as embodying the best in semiconductor technology. The world's top chip companies use Magma's EDA software to design and verify complex, high-performance ICs for communications, computing, consumer electronics and networking applications, while at the same time reducing design time and costs. Magma provides software for IC implementation, analysis, physical verification, characterization and programmable logic design, and the company's integrated RTL-to-GDSII design flow offers "The Fastest Path from RTL to Silicon"TM. Magma is headquartered in Santa Clara, Calif. with offices around the world. Magma's stock trades on Nasdaq under the ticker symbol LAVA. Visit Magma Design Automation on the Web at www.magma-da.com. Company: MEPTEC Booth/Stand: 843 Media Contact: Bette Cooper Phone: 650-988-7125 E-mail: [email protected] Web: www.meptec.org MEPTEC (Microelectronics Packaging and Test Engineering Council) is a trade association of over 600 semiconductor suppliers, manufacturers and individuals committed to enhancing the competitiveness of the back-end portion of the semiconductor business. MEPTEC is concerned exclusively with assembly, packaging and test issues and is dedicated to the advancement of that segment of the industry. For more information visit www.meptec.org. Company: MERITEC / Joy Signal Technology Booth/Stand: 820 Media Contact: Ken Braund, Sales & Marketing Manager Investor Relations Contact: Howard Venaleck, Chief Financial Officer Phone: (440) 354-3148 E-mail: [email protected] Web: WWW.MERITEC.COM Meritec and its affiliate, Joy Signal Technology, are vertically integrated manufacturers of high-performance connectors, cable assemblies, and complete interconnect systems serving the global electronics market. Four decades of experience in supplying engineered interconnect solutions to Communications, Medical, Instrumentation (ATE), Computer, Gaming, Commercial, Industrial and Military/Aerospace market segments. At DesignCon Booth 820, Meritec will be featuring its robust 4X and 12X Cabling and PCI Express Right Angle Connectors. Meritec also offers a complete line of 2mm HM Cabling, cPCI Cabling, Right Angle PCI Connectors, Sockets, Angled DIMM Sockets, Flat Flex Cabling. - From Concept to Connection - Meritec provides Design through Manufacture in the USA - WWW.MERITEC.COM - 888-MERITEC (888-637-4832). Company: Nova Semiconductors Booth/Stand: 806 Media Contact: Fuad Abu Nofal Phone: +1 408 918 7918 E-mail: [email protected] Web: www.novasemi.com/eda.html Nova will exhibit Chipmason at DesignCon/2006. "Chipmason" is a rapid silicon prototyping and floorplanning EDA toolset that supports package/chip co-design, hierarchical design flow and layout re-use methodology. Chipmason enables users to partition large designs, create accurate layout and timing abstracts/budgets. They can go from logic design view to a detailed floorplan with IO pads, power grid, block placement and pin assignment allowing them to quickly find and fix routing congestions as well as critical timing paths. Users save significant engineering cost when using Chipmason to create re-usable layout blocks, in the same chip or different chips. See details at: http://www.novasemi.com/eda.html Company: Optimal Corporation Booth/Stand: 613 Media Contact: Kristine Perham Investor Relations Contact: Dave DeMaria Phone: 408-363-6300 E-mail: [email protected] Web: www.optimalcorp.com Optimal Corporation is the leading provider of high-performance EDA tools, serving the IC, Packaging and PCB design markets. Our state-of-the-art technology enables advanced designers to rapidly analyze the signal integrity, power delivery, high-frequency and thermal/mechanical characteristics of their IC, Package and PCB designs. We are vital to our customers because we consistently deliver innovative, best-in-class solutions with the lowest cost of ownership. From our flagship PakSi-E and PakSi-TM to our best-in-class O-Wave and PowerGrid, Optimal has the technology to deliver unparalleled analysis capability and fast design turn-around for advanced designers and engineering groups. Our customers include top-tier IC design houses, package houses, global IC foundries, systems designers and advanced board designers. Company: Samtec Booth/Stand: 325 Media Contact: Pam Grieb Phone: 812/944-6733 E-mail: [email protected] Web: www.samtec.com Samtec manufactures Board-to-Board, Cable-to-Board, Panel-to-Board, and Panel-to-Panel interfaces. Worldwide revenue in 2005 was over $265 million. Samtec is an ISO 9001:2000, ISO 14001 and TS 16949 certified company. Samtec provides "Sudden Service" with High Speed, High Density, Micro, Rugged, Power, RF, and I/O connectors and cable assemblies, one to three day lead times, samples shipped via Air within 24 hours of request, our Signal Integrity Group, and our Sudden Information web site. Samtec has 17 locations worldwide to serve you. Company: Silicon Integration Initiative (Si2) Booth/Stand: 936 Media Contact: Bill Bayer Phone: 512-342-2244 E-mail: [email protected] Web: www.si2.org Si2 is a not-for-profit organization of industry-leading semiconductor, systems and EDA tool companies focused on improving productivity and reducing cost in creating and producing integrated silicon systems. We believe that through collaborative efforts, the industry can achieve higher levels of systems-on-silicon integration while reducing the cost and complexity of integrating future design systems. Si2 is uniquely positioned to enable collaboration through a strong implementation focus driven by its member companies. Si2 was founded in 1988 and today represents 95+ semiconductor and equipment manufacturers, electronic systems companies, and EDA tool suppliers all over the world. Company: Vitesse Booth/Stand: 1002 Ticker Symbol & Exchange: VTSS Media Contact: Juan Garza Investor Relations Contact: Yatin Mody Phone: 503 635 1194 E-mail: [email protected] Web: www.vitesse.com Vitesse designs, develops, and markets a diverse portfolio of high-performance, cost-competitive semiconductor solutions for communications and storage networks worldwide. Engineering excellence and dedicated customer service distinguish Vitesse as an industry leader in Gigabit Ethernet LAN, Ethernet-over-SONET, Advanced Switching, Fibre Channel, Serial Attached SCSI, Optical Transport, and other applications. Vitesse innovation empowers customers to deliver superior products for Enterprise, Access, Metro, and Core applications. Additional company and product information is available at www.vitesse.com. *T Note to Editors: Business Wire's PressPass allows you to create free, custom Web, RSS, and email-based news feeds from more than 160 industry options, dozens of subject categories and thousands of geographic preferences as well as by specific company filters. In addition, PressPass subscribers have access to exclusive content to experts, company profiles, email alerts, survey services and other media services. Note to Event Organizers: Add your trade show, conference, or event to www.tradeshownews.com, Business Wire's online event calendar. For information, email [email protected]. |
