[March 21, 2005]

ProMOS Deploys ESI 9830 Systems to Speed 300mm Memory Production Ramp

PORTLAND, Ore. --(Business Wire)-- March 21, 2005 -- Electro Scientific Industries Inc. (Nasdaq:ESIO), a leading provider of world-class production laser systems for microengineering applications, today announced that ProMOS Technologies has selected multiple ESI Model 9830 semiconductor link processing systems for its new 300mm fab in Taichung, Taiwan. The Model 9830 systems -- the first semiconductor link processing systems to be installed at the new 300mm facility -- will be used to ramp production of high-performance memory chips. Shipments will begin in ESI's fourth fiscal quarter ending May 28, and will culminate in ESI's fiscal year '06.

"We are delighted to continue our long-standing partnership with ESI," said Dr. Len Mei, senior Vice President of Manufacturing Group at ProMOS. "We conducted an extensive evaluation of vendors prior to making the selection for our new Taichung fab. We look forward to deploying the 9830 systems to help ensure a rapid production ramp."

Nick Konidaris, ESI's president and chief executive officer said, "The continued adoption of our memory repair systems substantiates our value proposition to DRAM manufacturers. This order clearly demonstrates ProMOS' confidence in our ability to deliver increased throughput, greater yield, and lower total cost of ownership. We look forward to supporting ProMOS, our valued customer, as they ramp their new 300mm fab to full production.

The platform of choice for leading semiconductor manufacturers, ESI's Model 9830 is specifically designed to boost yields for DRAMs, SRAMs, embedded memory devices and other laser-fuse applications on 90nm and future generations of semiconductor memory designs. The Model 9830 also includes innovative new optics and beam positioning designs, which deliver capabilities for processing next-generation 512Mb and 1Gb DRAM device designs. Built on ESI's proven legacy of technology excellence in DRAM link processing, the 9000 family of products has been surpassing the semiconductor industry's long-term roadmap requirements for more than two decades.

About ProMOS Technologies Inc.

ProMOS Technologies, Hsin-chu, Taiwan, is a full-blown memory solution provider and is renowned in the global DRAM industry for its outstanding performance in manufacturing excellence and technology advancement. The company manufactures high-performance and high-density commodity DRAM memory chips as well as pseudo-SRAM, lower power SDRAM and MCM products. ProMOS is listed on Taiwan's GreTai Securities Market. For more information, please visit www.promos.com.tw.

About ESI

Electro Scientific Industries, Inc. (ESI) is a pioneer and leading supplier of world-class production laser systems that help its microelectronics customers achieve compelling yield and productivity gains. The company's industry-leading, application-specific products enhance electronic-device performance in three key sectors -- semiconductors, components and electronic interconnect -- by enabling precision fine-tuning of device microfeatures in high-volume manufacturing environments. Founded in 1944, ESI is headquartered in Portland, Ore. More information is available at www.esi.com

This document may contain "forward-looking statements" within the meaning of Section 27A of the United States Securities Act of 1933 and Section 21E of the United States Securities Exchange Act of 1934. You should not place undue reliance on these forward-looking statements, which apply only as of the date of this document. The events mentioned in these forward-looking statements may occur in a different manner or at different times than those given in the forward-looking statement or not at all.

Such occurrence or nonoccurrence and our results of operations, financial conditions or business prospects implied thereby may differ materially from those expressed or implied in these forward-looking statements for a variety a reasons, including risks associated with the timely delivery and installations of equipment and machinery, malfunction of equipment or machinery, cyclicality and market conditions in the DRAM industry, demand for DRAMs, competition in our industry and other factors.

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