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TI Enhances Bluetooth(R) Technology Portfolio with Bluetooth Protocol Stack from Extended Systems
CANNES, France and DALLAS, Feb. 15 /PRNewswire/ -- Texas Instruments Incorporated (TI) today announced that it has enhanced its Bluetooth(R) technology portfolio by licensing the Bluetooth protocol stack and profiles suite from Extended Systems, a leading provider of mobile application solutions. TI now offers its mobile terminal customers a complete range of single-chip mobile connectivity solutions and software components for Bluetooth personal area networking. Additionally, TI will offer a pre- integrated Bluetooth protocol stack with its cellular systems solutions to speed time to market of new Bluetooth-enabled mobile phones.
"TI continues to be a leader in Bluetooth solutions for mobile phones. TI's Bluetooth single-chip DRP(TM) technology solutions deliver high- performance Bluetooth wireless networking with the low-power, small size and low cost required for 2.5G and 3G mobile terminals," said Marc Cetto, general manager, TI's Mobile Connectivity Solutions. "Licensing Extended Systems' leading Bluetooth protocol stack and profiles ensures we can provide the most complete and robust hardware and software solutions to our customers, speeding their time to market and reducing their development costs."
The Bluetooth protocol stack will be offered with TI's single-chip Bluetooth solutions for mobile terminal platforms, including the BRF6300, the first Bluetooth single chip using advanced 90nm CMOS technology. TI is uniquely positioned to provide further integration and innovation for Bluetooth-enabled mobile terminals with more than 15 years of expertise in cellular systems and a hardware and software Bluetooth technology portfolio. The first introduction of the Bluetooth protocol stack integrated with a TI cellular platform will be with TI's next generation EDGE chipset, the OMAPV1030, an enhanced, cost-efficient EDGE solution enabling handset manufacturers to bring advanced multimedia features to the growing mid-range wireless market. This will be followed by additional chipset solutions for 3G mobile terminals.
"Extended Systems has more than seven years of Bluetooth experience which it has used to develop one of the leading Bluetooth protocol stacks for cellular platforms. TI is now able to take this expertise to complete its Bluetooth product offering," said Chuck Jepson, president and CEO of Extended Systems. "Extended Systems' Bluetooth protocol stack and profiles suite enhances TI's leading single-chip Bluetooth platforms to provide complete system solutions for mobile terminal OEMs and ODMs worldwide."
About Extended Systems' Mobile Device Solutions
Extended Systems' software development kits (SDKs) for OMA Data Synchronization, OMA Device Management, Bluetooth wireless technology and IrDA (including infrared financial messaging) help manufacturers integrate wireless connectivity and synchronization into devices such as mobile phones, PDAs, printers and medical devices. With over nine years experience working in wireless networking protocols and hundreds of design wins, Extended Systems has amassed extensive expertise in providing easy-to-use mobile device solutions.
Texas Instruments - Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth, Digital TV and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit http://www.ti.com/wirelesspressroom for additional information.
About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com/ .
Trademarks
Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Texas Instruments is under license. OMAP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
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Texas Instruments Incorporated
CONTACT: in U.S., Marisa Speziale, +1-214-480-1795, orm-speziale@ti.com , or in Europe, Daniela Koeppe, +33-49322-2947, orkoe@ti.com , both of Texas Instruments Incorporated; or Jennifer Anderson,+1-972-308-9124, or janderson@golinharris.com , for Texas InstrumentsIncorporated. Please do not publish these e-mail addresses or phone numbers.
Web site: http://www.ti.com/http://www.ti.com/wirelesspressroomhttp://www.3gsmworldcongres
s.com/congress
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