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TeleCIS Wireless Announces New Multi-Protocol Chip Strategy for both WLAN and WiMAX Markets; WiMAX Forum Secretary and Board Member David Sumi Joins Company as VP of Marketing SANTA CLARA, Calif. --(Business Wire)-- Nov. 15, 2004 -- TeleCIS Wireless, Inc. today announced its intent to enter the WiMAX broadband wireless sector by building upon its notable success to date in the WLAN ("wi-fi") chip sector. The company also announced that David Sumi, Secretary of the WiMAX Forum with a seat on the Forum's Board of Directors, joins the company as VP of Marketing.In conjunction with its new direction, TeleCIS Wireless seeks to bridge broadband and mobility by providing cost-effective multi-protocol System-on-a-Chip (SoC) solutions combining WLAN and WiMAX technologies on a single chip. The company's first WiMAX SoC chipset, for fixed WiMAX network equipment, will be available in the second half of 2005. The company plans to introduce a combined WiMAX fixed / WiMAX mobile SoC chipset the second half of 2006, and a "converged" WLAN / WiMAX / WiMAX Mobile SoC chipset in 2007. "Today there are a multitude of technologies, such as WLAN, 2G, 3G and WiMAX, to provide wireless high speed connectivity for specific markets and applications," said David Sumi, VP of Marketing at TeleCIS Wireless. "This alphabet soup is meaningless for consumers, who are coming to expect ubiquitous wireless broadband services. We believe that the market opportunity lies in a multi-protocol approach that will help consumers automatically connect to the strongest signal available and switch between networks as needed. We see applications and end user devices for these chips ranging from traditional residential and business access supporting both voice and data, to laptops, PDAs and even cell phones with true broadband connections." The company's product portfolio today represents the first step on the path to this vision by offering cost effective 802.11 IP solutions with extended range and performance. These solutions are fully WiFi Alliance compatible and are ready to be taken to silicon. They are ideal for embedded wireless systems, enabling easy integration with broadband gateway chipsets or embedded into standard OEM products to add a wireless communications capability. The first WiMAX product from TeleCIS Wireless, the TCW1620, will be a complete System-on-a-Chip product supporting both PHY and MAC layers all the way to Ethernet to enable low cost devices for the broadband wireless market. When combined with RFICs on the company's reference design boards, network equipment vendors will have a simple, yet complete, package with everything necessary to build an entire Subscriber Station from RF in to Ethernet out. Designed to comply with the WiMAX Forum, the first three reference designs will be based on the 2.5GHz, 3.5GHz and 5.8GHz frequency bands. As VP of Marketing, David Sumi brings to TeleCIS a deep, experienced understanding of the BWA (broadband wireless access) marketplace and technologies. Previously at several start-ups in BWA, Mr. Sumi was one of the early pioneers establishing fixed BWA as a viable technology and market during its infancy stages. His extensive experience in both international and domestic BWA markets, combined with his technical grounding in RF and networking issues associated with these systems, gives him a solid overall perspective of the broadband wireless domain. Sitting on the Board of Directors of the WiMAX Forum as Secretary, Mr. Sumi continues his involvement in all facets of the industry. About TeleCIS Wireless TeleCIS Wireless, Inc. (www.telecis.com) is a Silicon Valley-based, fabless semiconductor company dedicated to delivering multi-protocol wireless System-on-a-Chip (SoC) solutions for more efficient Broadband Wireless Communications. Founded in January 2000 to develop chipsets for the WLAN market, the company generates revenue via a rich IP portfolio of performance leading 802.11a/b/g chipsets based on patent-pending wireless and smart antenna technologies. The company is currently enhancing its portfolio to include multi-protocol SoC Broadband Wireless chipsets supporting WiMAX, WiMAX Mobile (future) and WLAN protocols in a single ASIC. |
