[August 06, 2004] EV Group Receives Order for an Automated Temporary-Bonding Cluster from U.S. High-Brightness LED Maker SCHARDING, Austria --(Business Wire)-- Aug. 6, 2004 -- EV Group (EVG), a leading global supplier of wafer-bonding and lithography equipment, said today it has received an order from a U.S. customer for an automated and fully integrated temporary bonding cluster. The customer, whose name was not made public, manufactures high-brightness light-emitting diode (LED) devices. The EVG system enables processing of wafers well below 100 microns, which is key to making devices for high-intensity LEDs in mobile appliances, and other compound semiconductors, such as power devices and high-frequency devices. The growing use of thin and fragile wafers requires special techniques, including temporary bonding. The EVG850 Series systems bond wafers temporarily to allow backside processing. That feature increases production yield by protecting thin and fragile wafers. "This is the world's first system that perfectly centers carrier wafers, device wafers and the dry laminated adhesive tape, no matter what size, which is critical for all subsequent processing steps," said Dr. Peter Podesser, chief executive officer of EV Group. "This customer chose our fully automated temporary bonder platform for its reliability and its field-proven solution." EV Group's thin-wafer processing cluster systems can center wafers by optical alignment, which is essential for temporary bonding. The company's fully automated temporary bonder and debonder platforms can also integrate pre-processing and post-processing steps, such as coating, protective-film removal, film-frame mounting and cleaning. This feature enables a high degree of flexibility for polymer and wax bonding and dry laminated adhesive tape bonding and debonding. About EV Group Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding equipment (especially SOI bonding) and is a leader in lithography for advanced packaging and nanotechnology. The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology development, apply the technology to manufacturing challenges and expedite volume production. Headquartered in Scharding, Austria, EV Group operates via a global customer support network, with subsidiaries in Phoenix, Arizona; Cranston, Rhode Island; Yokohama, Japan; and Chung-Li, Taiwan. For more information, visit www.evgroup.com [ Back To TMCnet.com's Homepage ]