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Zarlink DirectConnect Embedded Ethernet Switch Simplifies Next-Generation Packet-Based Equipment Design
[May 25, 2006]

Zarlink DirectConnect Embedded Ethernet Switch Simplifies Next-Generation Packet-Based Equipment Design


OTTAWA, May 25 /PRNewswire-FirstCall/ -- Zarlink Semiconductor (NYSE/TSX:ZL) today expanded its DirectConnect family of embedded Ethernet switches with a new high-capacity aggregation and switch device that simplifies the design of high- density media processing, data plane and control plane cards used in wired, wireless and cable networks.


The ZL33020 embedded Ethernet switch is a 24 FE (Fast Ethernet) + 4 GE (Gigabit Ethernet) port device with 3.75 Mbits (480 Kbytes) of embedded memory for control databases and frame data buffer. The device supports multiple interface options, including SMII, RMII, GMII, TBI and MII, enabling designers to easily match a range of Ethernet interfaces available in complementary Ethernet devices.
Due to its wide availability, in recent years Ethernet has proven to be an efficient interface for connectivity between DSPs (digital signal processors), micro-controllers and NPUs (network processor units), in applications where heavy data traffic volume must be quickly processed and managed, including modem pools in wireless base stations, VoIP gateways, cable head-end modulators for IP video, high-end traffic management and control plane cards.
Most basic Ethernet switches for enterprise applications require external devices that draw from system resources and lock designers into a specific logic. For example, basic Ethernet switches with embedded PHYs (physical interfaces) require additional external PHYs to interface with the DSP, micro- controllers and NPUs. Previous-generation Ethernet switches used in VoIP applications may also require additional FPGAs (field programmable gate arrays) to map voice, fax or general streaming media traffic to the various DSPs used in the board.
"Zarlink DirectConnect switches provide a direct interface to DSPs, NPUs, micro-controllers and CPUs by supporting up to 28 Ethernet ports per device," said Paul Vu, product line manager, Packet Switching, Zarlink Semiconductor. "This capability enables significant BOM cost and power savings for our customers."
With the launch of the ZL33020 embedded switch, Zarlink's DirectConnect product family provides the most complete offering in embedded device solutions for FE and GE inter-processor connectivity. The DirectConnect portfolio, which also includes the ZL50400/2/4/5/7/8/9 and ZL50410/1 embedded switch families, allows Zarlink customers to chose from a wide variety of FE and GE port count configurations supporting industrial temperature range, an essential requirement in carrier-grade networking.
Powerful QoS and inter-processor traffic addressing scheme
Systems performing heavy media processing functions, such as modem base- band processing, echo cancellation, voice processing, compression, fax processing, radio modulation as well as intense traffic management and control plane functions, employ several DSP/NPU and micro-processor devices to simultaneously manage all transactions at full wire-speed. To maximize the use of bandwidth and avoid any traffic over-flow in the system, a robust bandwidth allocation and buffer management scheme is required when interconnecting all these devices.
The ZL33020 switch integrates flexible packet scheduling algorithms and buffer management functions. Designers can use the ZL33020 device to assign packets to four transmission classes on FE ports (eight classes for GE ports) and two levels of dropping precedence. Each packet is assigned a transmission priority and dropping precedence based on user-defined attributes.
When interconnecting multiple DSP/NPU devices in a cluster, the ZL33020 switch can implement packet addressing based on MAC Address, Ethernet Type and VLAN Identifier plus packet prioritization based on IEEE 802.1p priority, VLAN Tag, L3 DS/TOS field, IP Type of Service and Layer 4 logical port numbers. This flexible addressing allows system designers to maximize and split media processing resource allocation between DSP and NPU devices in the cluster.
Two types of flow control are available in the ZL33020. In half-duplex mode, all ports support backpressure flow control to minimize the effects of lost data during long traffic activity bursts. In full-duplex mode, IEEE 802.3x flow control is provided.
Support and availability
Zarlink's ZL33020 Ethernet switch is available now, priced at US$62.00 in 10 K volumes. A version for 16 FE + 2 GE configuration will be available soon. The ZL33020 device is supported by a full SDK (software development kit) including device driver source code, BSP (board supporting package) for the DirectConnect evaluation system and a comprehensive set of APIs (application programming interfaces) for chip configuration to simplify the programming of the chip registers and enable faster system development. Evaluation boards are available with various plug-in modules for 100/1000 Ethernet transceivers and CPUs based on PowerPC, ARM and MIPS.
For more on Zarlink's packet switching technology, please visit http://packetswitching.zarlink.com/.
About Zarlink Semiconductor
For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low- power communications. For more information, visit http://www.zarlink.com/.
Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at http://www.zarlink.com/ or contact investor relations.
Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: rapid technological developments and changes; our ability to continue to operate profitably and generate positive cash flows in the future; our exposure to product warranty claims resulting from product defects or failures; our dependence on our foundry suppliers and third-party subcontractors; increasing price and product competition; our exposure to currency exchange rate fluctuations and other factors inherent in our international operations; and other factors referenced in our Annual Report on Form 20-F for the fiscal year ended March 25, 2005. Investors are encouraged to consider the risks detailed in this filing.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
ZARLINK SEMICONDUCTOR

CONTACT: North America: Ed Goffin, Media Relations, (613) 270-7112,[email protected]; Asia-Pacific: Karen Li, The Hoffman Agency -China, 86-10-6507-0985, [email protected]; Europe: Simon Krelle, PinnacleMarketing Communications, 44 (0) 7973 821036, [email protected]

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