[July 16, 2008] TriQuint Secures Multiple Customer Orders Tweet (Wireless News Via Acquire Media NewsEdge) TriQuint Semiconductor, a RF front-end product manufacturer and foundry services provider, announced that more than 15 customers have chosen TriQuint's TQM7M5012, a 5x5mm Polar EDGE Power Amplifier Module (PAM) for forthcoming 3G handsets. The TQM7M5012 is a third generation PAM and member of TriQuint's HADRON II PA-Module Family. Aligned with a 3G chipset solution, the TQM7M5012 offers improvements in performance, size and cost over existing PA Modules and WEDGE Transmit Module solutions currently on the market, according to the company. TriQuint stated that its TQM7M5012 is built with TriQuint's patented CuFlip technology, a packaging technique that enables a more compact solution. When paired with an industry standard-WEDGE front-end module, the total solution is smaller, uses fewer components and is less expensive compared to existing solutions in the market, which use a 6x7mm WEDGE transmit module plus multiple GSM Rx SAW filters. Stuart Laval, Product Marketing Manager at TriQuint, said, "Our flip-chip technology enables an incredibly small form factor and superior electrical performance, helping customers to utilize precious board space for rich features while optimizing battery utilization. Customers are impressed with the elegant design of the TQM7M5012; TriQuint is seeing significant demand from a diverse customer base." ((Comments on this story may be sent to [email protected])) ((Distributed on behalf of 10Meters via M2 Communications Ltd - http://www.m2.com)) ((10Meters - http://www.10meters.com)) Copyright ? 2008 Wireless News [ Back To TMCnet.com's Homepage ]