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Tensilica Expands Dataplane Processor R&D Center in Pune, India
[April 23, 2012]

Tensilica Expands Dataplane Processor R&D Center in Pune, India

(Marketwire Via Acquire Media NewsEdge) PUNE, INDIA -- (Marketwire) -- 04/23/12 -- Tensilica®, Inc. today announced that it has moved its research and development center in Pune, India, to a new building, doubling the space previously available. Tensilica plans to increase headcount by at least 50 percent in the next year. Over the past six years, employees at Tensilica's Pune R&D center have become essential developers of Tensilica's dataplane processors (DPUs), which are used by chip designers to perform complex signal processing tasks, such as audio and baseband processing.

"The engineers in our Pune design center are an integral part of our R&D team, and they've tackled some of the most demanding projects," stated Jack Guedj, Tensilica's president and CEO. "We've asked them to take on several challenges and they've proven they have the background to do an excellent job in many engineering areas." Some of the projects Tensilica engineers have been working on in Pune include: audio and speech codecs for Tensilica's HiFi audio DSPs (digital signal processors), libraries, design verification, application engineering, and the IDE (integrated development environment) for Tensilica's DPUs.

"I'm extremely proud of the team we've assembled here in Pune," stated Subodh Shukla, director of the Pune R&D center. "We've been able to hire some of the top talent from across India because we can offer engineers the opportunity to grow and learn about leading edge processor/DSP architecture and chip design." About TensilicaTensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.


Editors' Notes: Tensilica and Xtensa are registered trademarks belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners. Tensilica's announced licensees include: Afa Technologies, ALPS, Aquantia, Astute Networks, AMD, Avision, Bay Microsystems, Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu Ltd., Fujitsu Semiconductor, Huawei, iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, Maxim, NEC Corporation, Nethra Imaging, Novatek, NuFront, NXP, Olympus Optical Co. Ltd., Panasonic Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, QLogic, Qualcomm Atheros, Samsung, Shanghai HDIC, SiBEAM, Sirius XM Radio, Sony, Stretch, TranSwitch Corporation, Triductor Technology, Valens Semiconductor, Validity Sensors, VIA, Victor Company of Japan (JVC), and Wolfson Microelectronics.

Add to Digg Bookmark with del.icio.us Add to Newsvine Press Contacts: Paula Jones (408) 327-7343 Email Contact Erika Powelson (831) 424-1811 Email Contact Source: Tensilica

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