Telit to Expand its Mobile Computing Offerings - Leveraging Collaboration with Intel®; New M.2 (NGFF) LTE and HSPA+ Data Cards Delivering up to 100Mpbs Speeds for Commercial and Consumer Applications
(M2 PressWIRE Via Acquire Media NewsEdge) Mobile World Congress, Barcelona, Spain - Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of a family of new data cards in the new M.2, Next Generation Form Factor (NGFF). The data cards augment the company's mobile computing product line currently comprised of mPCIe modules in HSPA+ and 1xEvDO cellular technologies. The new data cards are to be based on Intel's designs for LTE/DC-HSPA+ and HSPA+. They target not only new always-connected consumer and leading edge adopter applications such as Ultrabook(TM), laptops, tablets, but also commercial and industrial devices, as the current favored mPCIe form factor gets gradually replaced by M.2.
Telit has since 2002, applied Intel chipsets in many of its M2M modules but starting September 2012 the two companies agreed to design and market data card products, to keep pace with growing global demand for mobile broadband solutions. Telit's new M.2 lineup will include LN930 and HN930 product families conceived to address both global, regional, and speed requirements from cutting edge LTE/DC-HSPA+ and HSPA+ applications in mobile computing and gadgets. The Intel based LTE products are set to deliver speeds up to 100 Mbps down and 50 Mbps up; Dual Carrier HSPA+ 42 Mbps down and 11.5 Mbps up; and HSPA+ 21 Mbps down and 5.76 Mbps up.
The sub-compact and ultra slim 30x42mm M.2 data cards include global satellite (and assisted) positioning technology and certified drivers for Windows(TM)7 & 8. They also feature the industry's new Firmware Switching standard enabling the host Operating System and drivers to switch the card's firmware to the latest and specific cellular network approved revision, thus overcoming a longstanding complexity hurdle in provisioning cellular connectivity devices in non-operator branded consumer products. The switching is triggered by the simple insertion of the consumer or operator supplied SIM card into the PC's SIM card slot.
The new data cards interface to the host computer or gadget through a USB 3.0 connection supporting selective suspend (SS) and link power management (LPM). The SS feature allows the device driver to turn off (standby) the data card when it goes idle. When the card is again active or required, the system wakes it and resumes normal operation. Both SS and LPM are critical for latest generation battery powered consumer devices such as the Ultrabook(TM), conceived to ensure the user can reap several hours of use before a battery recharge is needed. The data cards employ these and other power-saving standards and policies to enhance the user experience of the host device.
Telit's industrialization plans call for start of samples program in Q2 and commercial availability in Q3 2013. To accelerate time to market for the PC OEMS, Intel has validated M.2 cards for use with the Intel Tablet and Ultrabook(TM) reference designs.
"Intel is pleased to be working with Telit to bring to market highly competitive modules offering worldwide coverage, high performance, and an optimized user experience," said Horst Pratsch, head of Product Line Modules & M2M at Intel Corporation. "Telit 3G and 4G M.2 modules take advantage of Intel's experience in ramping cellular technology globally in industry leading smartphone devices, along with integration, validation, and optimization in Intel computing platforms."
"Until recently, a large cellular infrastructure equipment vendor held a 50% market share in the data card market used in mobile computing, primarily with the mPCIe format. However, this supplier has exited the market representing a potentially disruptive development in the supply chain," said Oozi Cats, Telit CEO. "Telit is perfectly positioned to step in to fill the gap given the high confidence level we enjoy with our customers, particularly OEMs with respect to long-term, high-volume supply as well as our strong global and local support structure."
Ten years on, leveraging the industry's broadest portfolio of hardware in cellular, short range and positioning technologies, artfully complemented by services and connectivity from m2mAIR, Telit is M2M's One Stop Shop. By applying products and services in synergizing bundles, delivered with global support and logistics matching each individual need or want, Telit eliminates technical risk shortening time to market to the Internet of Things, wherever YOU come from - industry or segment.
Telit Wireless Solutions (AIM: TCM listed under Telit Communications PLC), a global enabler of machine-to-machine (M2M) communications providing cellular, short range and positioning module products; and through its business unit m2mAIR, M2M managed and value added services, including connectivity. Telit is M2M's top one-stop-shop offering synergistic hardware and value added services bundles. With over 12 years exclusively in M2M, the company constantly advances technology through six R&D centers around the globe; and markets products and services in over 80 countries.
By supplying scalable products interchangeable across families, technologies and generations, Telit is able to curb development costs, protect design investments and reduce technical risk. The company provides customer support and design-in assistance through 27 sales and support offices, a global distributor network of experts with over 30 competence centers, and the Telit Technical Support Forum.
Telit connects organizations to the Internet of Things (IoT) allowing them to wirelessly collect, process and respond to real-world data from connected devices, creating new efficiencies, revenue streams, societal and personal benefits. Join the conversation and learn more about Telit and its customers' innovative applications on Facebook and Twitter.
Copyright 2013 Telit Communication PLC. All rights reserved. Telit, Telit Wireless Solutions, Telit Communication PLC, telit.com, telit2market, Telit Technical Forum, m2mAIR, m2mAIR.com and all associated logos are trademarks of Telit Communications PLC in the United States and other countries. Other names used herein may be trademarks of their respective owners.
((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to email@example.com)).
(c) 2013 M2 COMMUNICATIONS
[ Back To TMCnet.com's Homepage ]