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Teardown Report of 360 N4s (1505-A01) with Full BOM with Cost Benchmarking and Component Analysis - Research and MarketsResearch and Markets has announced the addition of the "Teardown - 360 N4s (1505-A01)" report to their offering. Delivered by our team of industry experts, this 360 N4s (1505-A01) teardown report features a full BOM with cost benchmarking and component analysis to help you balance device cost and make decisions critical to your success. The Ultimate Competitive Benchmarking Tool It's imperative to make smart component cost and hardware design choices. Benchmarking tools like IHS (News - Alert) Teardown solutions can help you balance device cost-effectieness and feature-richness to satisfy the intended target market profitably. The Teardown Analysis Service provides complete, detailed analysis of electronics, from small devices such as wireless handsets and tablets to larger equipment such as servers and automotive infotainment systems. We deliver a complete assessment of all electronic, electro-mechanical, and mechanical components. Key Topics Covered: I. Executive Dashboard II. Overall Cost Model III. IC Price Evaluator IV. Bill of Materials V. Cost Estimation VI. Global Manufacturing Wage Study VII. Methodology VIII. Device Overview For more information about this report visit http://www.researchandmarkets.com/research/zjtlgb/teardown_360
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