TMCnet News
Research and Markets: Global Wafer-level Packaging Equipment Market 2015-2019 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu DominatingResearch and Markets (http://www.researchandmarkets.com/research/3s2lvp/global) has announced the addition of the "Global Wafer-level Packaging Equipment Market 2015-2019" report to their offering. ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process. The short replacement cycle of portable electronic devices is one of the major trends witnessed in the market. The launch of new versions of portable electronic devices such as smartphones, phables, and tablets has led consumers to replace their old devices with new advanced models. According to the report, the increased demand for smartphones and tablets worldwide, particularly in the emerging markets, is one of the major drivers in the market. This has led to the increased demand for semiconductor wafers and ICs, driving the growth of the Global Wafer-level Packaging Equipment market. Further, the report states that the rapid changes in technology are one of the major challenges in the market. The semiconductor industry is evolving at a significant rate, leading to design complexities in ICs. To accommodate these advanced IC designs, wafer-level packaging equipment manufacturers incur huge costs in the production of advanced equipment. Key Vendors Key Topics Covered:
For more information visit http://www.researchandmarkets.com/research/3s2lvp/global
|
