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Qualcomm to fund technology innovation programme
[May 08, 2009]

Qualcomm to fund technology innovation programme


New Delhi, May 07, 2009 (Asia Pulse Data Source via COMTEX) -- US-based CDMA mobile technology inventor Qualcomm today launched a programme aimed at helping entrepreneurs develop innovations for wireless technology with a total seed funding of USD 550,000.

"The Qualcomm Venture QPrize competition is open to entrepreneurs in North America, Europe, China and India and will provide USD 550,000 in total seed funding to help entrepreneurs...," Qualcomm said in a statement.

The company is looking for innovations in consumer/enterprise applications and services, communication devices, semiconductor and component technologies, mobile platforms, digital media and content, cleantech and healthcare technologies and services.


The deadline for business plan submission is July 31, 2009.

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