Novati Technologies Selects Applied Materials to Create Advanced 200mm Line

AUSTIN, Texas, July 12, 2016 /PRNewswire/ -- Since the company's inception in 2012, Novati Technologies has achieved tremendous growth, establishing itself as the go-to fab provider for "More than Moore" applications – including 3D and heterogeneous architectures, as well as advanced materials to enable new sensor and circuit functionality.

Novati's unique facility is capable of supporting 200mm and 300mm wafers with critical dimensions from tens of microns to 65nm and below, and either aluminum or copper back-end of line interconnects. This tremendous flexibility allows the company o easily integrate MEMS, Microfluidic and Photonic elements with advanced high-density circuits and electrical routing.  To further augment this broad array of capabilities, Novati has teamed with Applied Materials, Inc., the world's largest supplier of semiconductor manufacturing equipment, to install a suite of state of the art 200mm process equipment into the facility:

• Applied Mira Mesa™ CMP with Contour 8-zone pressure control heads for superior uniformity control over challenging topographies and complex materials
• Applied Endura® 5500 with SIP TI, EnCoRe Cu, and TA for high aspect ratio step coverage
• Applied Raider® 8-Module 200mm/300mm plating tool including Raptor-M for TSV fill and CDF-III for advanced damascene plating demands  

"Achieving success as a high mix, small-volume mixed mode development and production fab requires us to have advanced capabilities that are also proven production worthy.  Our selection of equipment from Applied Materials addresses both of these needs in parallel," said John Behnke, President of Novati.

"We are excited to support Novati's mission of enabling innovative and disruptive new chip solutions with our world-class equipment capability and productivity solutions," said Werner Finsterbusch, vice president and general manager of the Applied Global Services Equipment Products Group at Applied Materials.

In addition to the equipment from Applied Materials, Novati has recently added tools to enhance its capabilities in Lithography, Bonding and Acoustic Microscopy that further support its focus on 2.5D, 3D and heterogeneous substrate integration.

Novati provides trusted, advanced integration solutions that accelerate time to market for its clients' complex chip technologies in the Aerospace & Defense, Bioelectronics, High Performance Computing and Communications industries. http://www.novati-tech.com/

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SOURCE Novati Technologies

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