[May 25, 2013] Micron Technology Assigned Patent for Interconnects for Packaged Semiconductor Devices and Methods for Manufacturing Such Devices Tweet (Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., May 25 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,445,330) developed by Suan Jeung Boon, Singapore, Yong Poo Chia, Singapore, and Meow Koon Eng, Singapore, for "interconnects for packaged semiconductor devices and methods for manufacturing such devices." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Packaged semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a packaged semiconductor assembly includes a die attached to a support layer. A plurality of interconnects are embedded in and project from the support layer, such that the support layer at least partially retains the interconnects in a predetermined array. An encapsulant is molded around each of the interconnects and encases at least a portion of the die, support layer and interconnects." The patent application was filed on April 30, 2012 (13/459,801). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,445,330&OS=8,445,330&RS=8,445,330 Written by Satyaban Rath; edited by Hemanta Panigrahi. SR0525HP0525-881154 (c) 2013 Targeted News Service [ Back To TMCnet.com's Homepage ]