GDSI Announces Scott Sullivan as Chief Technologist

SAN JOSE, Calif., Aug. 22, 2017 /PRNewswire/ -- Grinding & Dicing Services Incorporated ("GDSI") is pleased to announce that Scott Sullivan has recently joined our team as Chief Technologist, reporting to the President.

"I have followed Scott throughout his career, soliciting his opinion on vexing technical problems or asking for his read on emerging technologies which could benefit GDSI customers. Scott always had great insight. GDSI fully intends on utilizing his talents as we engage our employees, customers and suppliers," said Joe Collins, President of GDSI. "The MEMS market has entered a growth phase and along with that come several complex manufacturing challenges. Similarly, advanced packaging developments have created technical hurdles for processing ultrathin wafers which is GDSI's core competency. Scott has worked industry leaders, identifying technological gaps while finding practical solutions. We expect he will lead GDSI and its customers in a smilar manner."

Prior to joining GDSI, Sullivan was the Chief Technologist at DISCO Hi-Tec America for 14 years. He also was a business development manager at ESI on laser cutting and Suss MicroTec for temporary wafer bonding.

"I am excited to join the team at GDSI and look forward to working with a wide variety of customers who help to bring new and innovative products to the world," said Sullivan. "I have collaborated with GDSI over the years, watching it evolve into a best of breed supplier who enables their customers for product realization. I hope to contribute towards the continued success of GDSI."

Grinding & Dicing Services Incorporated
Founded in the Silicon Valley in 1992, GDSI stands tall as the premier wafer thinning and dicing subcontractor available to industry. GDSI teams with some of the most advanced research and development groups in the world on a variety of leading edge IC technologies. We offer an approved, secure environment for Multi-reticle, prototype, and low-mid volume production wafers. In addition to our Quality Management System ("QMS") which governs all phases of our process flow, GDSI has the requisite staff and control plans to ensure strict compliance with Trusted program details. GDSI is ITAR and ISO registered. For additional information regarding our suite of services, please visit our website at www.wafergrind.com.

Contact: Joe Collins, President (408-961-3720) or [email protected]

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SOURCE Grinding & Dicing Services Incorporated

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