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e-Shuttle to Feature Electron-Beam Direct Write (EBDW) Technology at GSA Suppliers Expo
[October 08, 2008]

e-Shuttle to Feature Electron-Beam Direct Write (EBDW) Technology at GSA Suppliers Expo


(Wireless News Via Acquire Media NewsEdge)
e-Shuttle, a company established by Fujitsu Microelectronics and
Advantest Corp. to provide prototyping services for large-scale ICs,
announced it will feature its Electron-Beam Direct Write (EBDW)
technology at the GSA Suppliers Expo & Conference in the Santa Clara
Convention Center, October 2.

At the event, e-Shuttle noted, it will show a 300mm wafer developed
using its 65nm technology, along with a roadmap highlighting features
and developments. e-Shuttle said it is offering the EBDW technology for
manufacturing 65nm CMOS logic ICs, which represents the first
full-scale application of EBDW techniques for complex devices. The
company is also applying EBDW technology for devices using 90nm process
technology, manufacturing structured ASICs for fabless semiconductor
companies. Producing single-layer via interconnect patterns using EBDW
provides a short delivery cycle with mask-less production, with yields
comparable to optical lithography.

The 300mm wafer shuttle service -- in which wafer delivery combines the
orders of multiple customers -- reduces costs. Via layers are formed
using EBDW, reducing the significant costs involved in forming via
layers for ultra-fine interconnects using masks. The EBDW technology
has achieved excellent results without compromising yield,

demonstrating that EB lithography and ArF lithography can coexist in
the fabrication process.

The e-Shuttle F3000 system features a short focal length lens that
reduces coulomb interaction when beam current density is high. The
F3000 also can project as many as 100 different patterns in a single
block area, with a total of 12 blocks available for the user. In
addition, in-situ cleaning eliminates the risk of contamination and
assures high up-time operation.


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Copyright ? 2008 Wireless News

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