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Building Solutions with Embedded Components(Targeted News Service Via Acquire Media NewsEdge) BANNOCKBURN, Ill., May 20 -- The IPC-Association Connecting Electronics Industries issued the following news release: As it becomes more costly to push semiconductor technologies to new heights, companies are looking at packaging techniques to squeeze more circuitry into smaller housings. A growing number of firms are embedding passives and/or actives into printed boards, letting them attain high densities and high performance using less expensive chips. Embedded components can save plenty of surface space for other devices, helping design teams improve performance and expand functionality without the cost of employing advanced chips. While one lure of embedded technology is that it relies on widely available components, it's not simple to bury these devices inside a printed board. This concept has seen fairly solid usage in compact handheld devices such as smart phones, but it's still a relatively new technology in high reliability designs. Those who want to catch this new wave in system design will be able to learn a lot at the upcoming IPC/FED Conference on Embedded Components (http://www.ipc.org/embedded-conference) in Frankfurt, Germany on June 4-5. The conference lineup includes a broad array of speakers who come from diverse fields including manufacturing, design and research. This diversity will give attendees a chance to understand the many factors that go into a high reliability design. Presentations will range from overviews to "deep dives." Jurgen Wolf, assistant manager of research and development of Wurth Elektronik will set the stage for the technology, discussing the current state of the art and future directions. Andreas Ostmann will build on this discussion with a longer-term view. He's a group manager for embedding and substrates at Fraunhofer, IZM, Europe's largest application-oriented research organization. Together the pair will give attendees a good base for further discussions that go into greater detail on many different aspects of embedded development and production programs. Other speakers will focus on the design challenges that begin the process. For example, Wittenstein Electronics GmbH and FlowCAD are teaming up to explain how Wittenstein used FlowCAD tools to develop a new generation of electronic and software components for drive technologies. "We will show the CAD flow which is needed to capture all relevant information for a design with embedded components," said Dirk Muller of FlowCAD. "Using the description of the design project we did together with Wittenstein, we will explain the thought process, including the possibilities and alternative designs." Additional discussions of design issues will be presented by Per Viklund, director of IC packaging & RF at Mentor Graphics Inc.; Ralf Bruning, production manager for high speed design solutions at Zuken; and Vern Solberg, a consultant at Invensas. These design processes will have to be closely linked to the manufacturing capabilities that will be used to move the design into full production volumes. Mike Morianz, manager of advanced packaging technology and innovation at AT&S Osterreich, will describe some of the solutions that this international design and manufacturing specialist has examined. Other manufacturers will discuss the trend to move embedded technology beyond consumer applications. "We are developing solutions not only for module embedding, which is driven by the mobile phone industry, but also for motherboard embedding and power embedding," said Christian Rossle, vice president of sales & marketing, Schweizer Electronic AG. "This offers many advantages for automotive and industrial applications." TNS hc11-130523-4360226 StaffFurigay (c) 2013 Targeted News Service |