TMCnet News
Media Alert: Rambus to Showcase High-performance SerDes Solutions at the eSilicon Live Seminars in Tokyo and ShanghaiRambus (News - Alert) Inc. (Nasdaq: RMBS):
Join Rambus at the live seminars titled, "A Complete 14nm 2.4D, HBM2, SerDes ASIC Solution" that discusses solutions for delivering 2.5D systems to support the development of applications in the high-performance computing, networking, deep learning and 5G markets. The live seminars will be held in both Tokyo and Shanghai. Speaker Details
For more information, visit https://www.rambus.com/events. Follow Rambus:
Company website: rambus.com About Rambus Memory and Interfaces Division The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality. About Rambus Inc. Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com. Source (News - Alert): Rambus Inc. View source version on businesswire.com: http://www.businesswire.com/news/home/20171210005075/en/ |