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Research and Markets Adds Report: Rohm DC/DC Micro Converter TDK-EPC Embedded Die Process Reverse Costing Analysis
[February 01, 2013]

Research and Markets Adds Report: Rohm DC/DC Micro Converter TDK-EPC Embedded Die Process Reverse Costing Analysis

Feb 01, 2013 (Close-Up Media via COMTEX) -- Research and Markets has announced the addition of the "Rohm DC/DC Micro Converter TDK-EPC Embedded Die Process Reverse Costing Analysis" report to its offerings.

In a release, Research and Markets noted that report highlights include: Rohm and TDK-EPC have joined forces to provide an alternative solution for embedded die technology. This SiP module is a second-source supply of the Texas Instruments MicroSiPDC-DC Converter. Although fully compatible, the process and cost structure is very different from the previously analyzed TI module with a packaging performed by AT&S.

Embedded die packaging is an emerging solution to increase the integration in mobile products. This technology is supported by a game-changing, low-cost, panel-based PCB infrastructure that has the potential to create an alternative supply chain for today's well established packaging standards.

This report provides complete teardown of the Embedded die package with: - Detailed photos - Material analysis - Schematic assembly description - Manufacturing Process Flow - Cost analysis, step by step - Manufacturing cost breakdown - Selling price estimation Key Topics Covered: Glossary Overview/Introduction - Executive Summary - Reverse Costing Methodology Physical Analysis - Synthesis of the Physical Analysis - Physical Analysis Methodology - Module Views and Dimensions - Module Passive Components Assembly - Module X-Ray - Module Delamination -Layer 1 - Module Delamination -Layer 2 - Module Delamination -Embedded IC Die - Module Delamination -Layer 3 - Module Delamination -Layer 4 - IC Die Views and Dimensions - IC Die Markings - IC Die Delayering - IC Die Process - Cross-section 1 Overview - Cross-section 1 Details - Cross-section 2 Overview - Cross-section 2 Details - Cross-section 3 Overview - Cross-section 3 Details Manufacturing Process Flow - Global Overview - IC Process Flow - Description of the IC Wafer Fabrication Unit - SESUB Packaging Process Flow - Description of the Packaging Panel Fabrication Cost Analysis - Synthesis of the Cost Analysis - Main Steps of Economic Analysis - Yields Explanation - Yields Hypotheses - IC Front-End : Hypotheses - IC Front-End Cost - IC Back-End 0: Probe TestCost - IC Back-End 0: RDL, Thinning and Dicing Cost - IC Die Cost - Back-End: Embedded Die Packaging Hypotheses - Back-End: SESUB Panel Cost - Back-End: SESUB Panel Cost per Process Steps - Back-End: SESUB Panel Equipment Cost per Family - Back-End: SESUB Panel Material Cost per Family - Back-End: Packaging Price - Back-End: Final Test - SiPModule Cost Estimated Price Analysis Report information: researchandmarkets.com/research/x3mcbx/rohm_dcdc_micro ((Comments on this story may be sent to newsdesk@closeupmedia.com))

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